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MC14052BF

Onsemi

MC14052BF by Onsemi

MC14052BF by Onsemi is a CMOS differential multiplexer with 2 functions, 4 channels, and 16 terminals. It operates at temperatures from -55 to 125 °C and has a max supply voltage of 18 V. Ideal for military-grade applications requiring fast switching times and high isolation levels.

Median Price

$0.172

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,801 parts In-Stock

1+ parts

-

100+ parts

$0.172

1k+ parts

$0.143

10k+ parts

$0.127

1,801

-

$0.172

$0.143

$0.127

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 184 parts In-Stock

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$0.134

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184

$0.134

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Vyrian

USA . 5,147 parts In-Stock

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5,147

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Distributors (Availability)

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Corphita

USA . 559 parts In-Stock

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$0.127

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559

$0.127

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Corohmni

South Africa . 139 parts In-Stock

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$0.141

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139

$0.141

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AZTECH Wire

Italy . 513 parts In-Stock

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$17.990

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513

$17.990

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QUARKTWIN TECHNOLOGY LTD

USA . 26,697 parts In-Stock

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26,697

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SupplyDigital Components

Austria . 8,272 parts In-Stock

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TANS Electronics

Latvia . 7,600 parts In-Stock

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7,600

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Kulean Microsystems

USA . 6,718 parts In-Stock

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Problanco Electronics

Mexico . 5,053 parts In-Stock

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Microchip USA

USA . 485 parts In-Stock

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UHIMA Technologies

Türkiye . 123 parts In-Stock

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Overview

Discover the MC14052BF by Onsemi, a cutting-edge multiplexer & switch offering top-quality performance and reliability. Manufactured by Onsemi, a trusted leader in semiconductor technology, this product is versatile and ideal for various applications. With its small outline package style and wide temperature range, this differential multiplexer ensures seamless operation even in challenging conditions. Experience the value and benefits of fast switching times, low on-state resistance, and excellent isolation. Upgrade your projects with the MC14052BF and unlock limitless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

No. of Functions: 2

Having 2 functions in one package increases functionality and saves space on the circuit board.

Nominal Supply Voltage (Vsup): 5 V

Suitable supply voltage for efficient operation in many electronic systems.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliability in extreme conditions.

Minimum Operating Temperature: -55 °C

Low operating temperature capability allows for use in diverse environments.

No. of Terminals: 16

Sufficient number of terminals for connections and versatility in circuit design.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient operation.

Technical Specifications

Multiplexers & Switches MC14052BF attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

No. of Channels:

4

No. of Functions:

2

No. of Terminals:

16

Nominal Off-state Isolation:

50 dB

Nominal On-state Resistance Match:

70 ohm

Maximum On-state Resistance (Ron):

1050 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

700 ns

Maximum Switch-on Time:

700 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

5.275 mm

Trade Compliance

MC14052BF Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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