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MC14066BDTR2

Onsemi

MC14066BDTR2 by Onsemi

MC14066BDTR2 by Onsemi is a CMOS SPST multiplexer with 4 functions, 14 terminals, and 5V nominal voltage. It operates in temperatures ranging from -55 to 125 °C and has a max on-state resistance of 1050 ohm. Ideal for military-grade applications requiring high isolation and fast switching times.

Median Price

$0.860

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 1,500 parts In-Stock

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$0.860

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1,500

$0.860

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Vyrian

USA . 4,268 parts In-Stock

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Electronic Expediters

USA . 2,042 parts In-Stock

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2,042

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Digiode

USA . 285 parts In-Stock

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285

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North Shore Components

USA . 197 parts In-Stock

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197

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,313 parts In-Stock

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$4.500

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$4.500

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Aztec Data Supply Inc.

USA . 2,887 parts In-Stock

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$9.973

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$9.973

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AZTECH Wire

Italy . 366 parts In-Stock

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$16.171

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$16.171

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Corohmni

South Africa . 64 parts In-Stock

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$18.881

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64

$18.881

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Kulean Microsystems

USA . 6,732 parts In-Stock

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Problanco Electronics

Mexico . 6,555 parts In-Stock

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Continental Prestige Electronics

USA . 5,621 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,959 parts In-Stock

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SupplyDigital Components

Austria . 4,948 parts In-Stock

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Microchip USA

USA . 2,876 parts In-Stock

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TANS Electronics

Latvia . 1,926 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Corphita

USA . 727 parts In-Stock

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727

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UHIMA Technologies

Türkiye . 303 parts In-Stock

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Overview

Enhance your electronic projects with the MC14066BDTR2 multiplexer and switch from Onsemi. Known for their top-quality products, Onsemi delivers reliable components that meet the highest standards in the industry. Perfect for a wide range of applications, this versatile device offers customers unmatched value and performance. Whether you're working on a hobby project or a professional endeavor, the MC14066BDTR2 provides seamless functionality and ease of use. Upgrade your circuits with Onsemi's cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and space in the overall design.

Nominal Supply Voltage (Vsup): 5 V

Operates at a common and stable voltage level, ensuring compatibility with many standard power supplies.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for a wide range of operating environments.

Minimum Operating Temperature: -55 °C

Capable of functioning in extremely low temperatures, making it versatile for various applications.

Technical Specifications

Multiplexers & Switches MC14066BDTR2 attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

14

Nominal Off-state Isolation:

50 dB

Nominal On-state Resistance Match:

25 ohm

Maximum On-state Resistance (Ron):

1050 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

80 ns

Maximum Switch-on Time:

120 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

MC14066BDTR2 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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