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MC14066BDTEL

Onsemi

MC14066BDTEL by Onsemi

MC14066BDTEL by Onsemi is a CMOS SPST IC with 4 functions, operating at -55 to 125°C. It has a supply voltage range of 3-18V and offers separate outputs with 1050 ohm on-state resistance. Ideal for military-grade applications requiring high isolation and fast switching times in a compact SOT package.

Median Price

$0.089

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 43,302 parts In-Stock

1+ parts

-

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$0.082

43,302

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$0.082

Rochester

USA . 13,302 parts In-Stock

1+ parts

-

100+ parts

$0.092

1k+ parts

$0.077

10k+ parts

$0.068

13,302

-

$0.092

$0.077

$0.068

DigiKey

USA . 13,302 parts In-Stock

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-

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$0.120

13,302

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$0.120

Verical

USA . 13,302 parts In-Stock

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$0.086

13,302

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$0.086

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.068

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-

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10

$0.068

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Digiode

USA . 1,351 parts In-Stock

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$0.072

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$0.072

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DigiKey Marketplace

USA . 43,302 parts In-Stock

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43,302

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Vyrian

USA . 42,971 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 394 parts In-Stock

1+ parts

$0.066

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394

$0.066

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Argo Parts USA

USA . 2,998 parts In-Stock

1+ parts

$0.068

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$0.066

2,998

$0.068

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$0.066

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.068

100+ parts

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$0.064

10k+ parts

$0.063

2,000

$0.068

-

$0.064

$0.063

Corphita

USA . 262 parts In-Stock

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$0.068

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262

$0.068

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Continental Prestige Electronics

USA . 43,302 parts In-Stock

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$0.063

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$0.063

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QUARKTWIN TECHNOLOGY LTD

USA . 28,931 parts In-Stock

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28,931

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TANS Electronics

Latvia . 8,359 parts In-Stock

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8,359

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SupplyDigital Components

Austria . 2,600 parts In-Stock

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Problanco Electronics

Mexico . 459 parts In-Stock

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UHIMA Technologies

Türkiye . 77 parts In-Stock

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Kulean Microsystems

USA . 59 parts In-Stock

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Overview

Enhance your electronic designs with the MC14066BDTEL from Onsemi, a top-tier manufacturer known for quality and innovation. This multiplexer & switch offers unparalleled performance in various applications, providing customers with reliable functionality and seamless operation. With its advanced technology and superior design, this product ensures optimal efficiency and accuracy, making it the ideal choice for your next project. Trust Onsemi to deliver excellence, choose the MC14066BDTEL for superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into circuit boards.

No. of Functions: 4

Multiple functions in one device provide versatile options for signal routing and control.

Nominal Supply Voltage (Vsup): 5 V

Operates efficiently at a standard 5V supply voltage commonly used in electronic systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in extreme environmental conditions.

Minimum Operating Temperature: -55 °C

Wide operating temperature range enables usage in both hot and cold environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Technical Specifications

Multiplexers & Switches MC14066BDTEL attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

14

Nominal Off-state Isolation:

50 dB

Nominal On-state Resistance Match:

25 ohm

Maximum On-state Resistance (Ron):

1050 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

80 ns

Maximum Switch-on Time:

120 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

4.4 mm

Trade Compliance

MC14066BDTEL Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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