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MC10SX1190DTG

Onsemi

MC10SX1190DTG by Onsemi

MC10SX1190DTG by Onsemi is a Line Transceiver IC with 20 terminals, operating at -40 to 85 °C. It features a max transmit delay of 0.65 ns and receive delay of 0.38 ns. Ideal for industrial applications requiring differential input characteristics and a supply voltage range of 3-5.5 V.

Median Price

$12.398

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,950 parts In-Stock

1+ parts

-

100+ parts

$11.020

1k+ parts

$9.860

10k+ parts

$9.280

9,950

-

$11.020

$9.860

$9.280

Verical

USA . 225 parts In-Stock

1+ parts

-

100+ parts

$13.775

1k+ parts

$12.325

10k+ parts

$11.600

225

-

$13.775

$12.325

$11.600

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,678 parts In-Stock

1+ parts

$11.666

100+ parts

-

1k+ parts

-

10k+ parts

-

1,678

$11.666

-

-

-

Vyrian

USA . 3,119 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,119

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 195 parts In-Stock

1+ parts

$11.040

100+ parts

-

1k+ parts

-

10k+ parts

-

195

$11.040

-

-

-

Corphita

USA . 1,789 parts In-Stock

1+ parts

$11.052

100+ parts

-

1k+ parts

-

10k+ parts

-

1,789

$11.052

-

-

-

AZTECH Wire

Italy . 712 parts In-Stock

1+ parts

$13.520

100+ parts

-

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-

10k+ parts

-

712

$13.520

-

-

-

Continental Prestige Electronics

USA . 9,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

9,950

-

-

-

-

Problanco Electronics

Mexico . 7,892 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,892

-

-

-

-

Kulean Microsystems

USA . 2,042 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,042

-

-

-

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TANS Electronics

Latvia . 1,868 parts In-Stock

1+ parts

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100+ parts

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1,868

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-

-

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SupplyDigital Components

Austria . 1,248 parts In-Stock

1+ parts

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1,248

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Microchip USA

USA . 422 parts In-Stock

1+ parts

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422

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UHIMA Technologies

Türkiye . 337 parts In-Stock

1+ parts

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337

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Perfect Parts

USA . 168 parts In-Stock

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168

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Overview

With the MC10SX1190DTG by Onsemi, you can expect top-notch quality and reliable performance. Onsemi is a trusted manufacturer known for delivering cutting-edge technology in the Line Drivers & Receivers category. This product offers fast transmit and receive delays, making it perfect for applications where timing is critical. Its small outline and thin profile design make it versatile and easy to integrate into your projects. Experience the value of seamless communication and increased efficiency with the MC10SX1190DTG from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protects the internal components from external elements, making this product a long-lasting choice.

Surface Mount: YES

The surface mount design allows for easy installation on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this line driver/receiver can safely operate within standard voltage ranges, providing stable performance.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to integrate this product into various electronic devices and systems.

Maximum Transmit Delay: 0.65 ns

The low transmit delay of 0.65ns ensures fast data transmission, making this product suitable for high-speed communication applications.

No. of Terminals: 20

With 20 terminals, this line driver/receiver can support a wide range of input and output connections, making it versatile for different circuit configurations.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V allows this product to operate efficiently even in low-power situations, increasing its flexibility in various settings.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in extreme environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40 °C allows this product to operate in cold environments without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides corrosion resistance and ensures stable electrical connections, improving the overall reliability of the product.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options and easy connection to external devices, enhancing the usability of this product.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2mm minimizes the profile of this product, making it suitable for compact electronic designs.

Width: 4.4 mm

The narrow width of 4.4mm allows for easy integration into tight spaces, expanding the potential applications of this line driver/receiver.

Differential Output: YES

The differential output provides improved noise immunity and signal integrity, making this product a reliable choice for data transmission in noisy environments.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature of 260 °C ensures secure solder connections during assembly, reducing the risk of component detachment and improving overall product quality.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification indicates that this product can withstand harsh operating conditions, making it suitable for demanding industrial applications.

Maximum Receive Delay: 0.38 ns

The low receive delay of 0.38ns ensures quick response times for incoming data, enhancing the overall performance of this line driver/receiver.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and inspection processes during assembly, ensuring efficient production and high-quality connections.

Input Characteristics: DIFFERENTIAL

The differential input characteristics improve noise rejection and signal integrity, making this product ideal for high-speed data transmission applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources, making integration into existing systems straightforward.

Terminal Pitch: 0.65 mm

The tight terminal pitch of 0.65mm allows for dense packing of components on circuit boards, optimizing space utilization and enabling complex circuit designs.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type ensures seamless communication between different network elements, enhancing compatibility and interoperability in networking applications.

Technical Specifications

Line Drivers & Receivers MC10SX1190DTG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

.38 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.65 ns

Width:

4.4 mm

Trade Compliance

MC10SX1190DTG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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