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MC10LVEP16DTG

Onsemi

MC10LVEP16DTG by Onsemi

MC10LVEP16DTG by Onsemi is a Line Driver & Receiver with 8 terminals, operating at -40 to 85 °C. It features differential output, peak reflow temp of 260°C, and transmit delay of 0.32 ns. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

$4.208

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,557 parts In-Stock

1+ parts

-

100+ parts

$3.740

1k+ parts

$3.350

10k+ parts

$3.150

5,557

-

$3.740

$3.350

$3.150

Verical

USA . 4,486 parts In-Stock

1+ parts

-

100+ parts

$4.675

1k+ parts

$4.188

10k+ parts

-

4,486

-

$4.675

$4.188

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,119 parts In-Stock

1+ parts

$3.962

100+ parts

-

1k+ parts

-

10k+ parts

-

2,119

$3.962

-

-

-

Vyrian

USA . 3,931 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,931

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 141 parts In-Stock

1+ parts

$3.750

100+ parts

-

1k+ parts

-

10k+ parts

-

141

$3.750

-

-

-

Corphita

USA . 1,391 parts In-Stock

1+ parts

$3.753

100+ parts

-

1k+ parts

-

10k+ parts

-

1,391

$3.753

-

-

-

AZTECH Wire

Italy . 888 parts In-Stock

1+ parts

$10.330

100+ parts

-

1k+ parts

-

10k+ parts

-

888

$10.330

-

-

-

TANS Electronics

Latvia . 6,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,540

-

-

-

-

Continental Prestige Electronics

USA . 5,557 parts In-Stock

1+ parts

-

100+ parts

$3.750

1k+ parts

-

10k+ parts

-

5,557

-

$3.750

-

-

Microchip USA

USA . 4,845 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,845

-

-

-

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SupplyDigital Components

Austria . 4,785 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,785

-

-

-

-

Kulean Microsystems

USA . 3,228 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,228

-

-

-

-

Problanco Electronics

Mexico . 2,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,900

-

-

-

-

UHIMA Technologies

Türkiye . 968 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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968

-

-

-

-

Overview

Discover the MC10LVEP16DTG by Onsemi, a high-quality line driver & receiver that offers exceptional performance and reliability. With a small outline and thin profile package design, this product is ideal for industrial applications where precision and efficiency are paramount. Designed to operate in extreme temperatures, this line transceiver ensures seamless communication with differential outputs for optimal signal integrity. Trust Onsemi, a leading manufacturer, to deliver cutting-edge technology that meets your needs. Upgrade your systems with the MC10LVEP16DTG and experience unparalleled value and benefits in your operations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the line driver & receiver.

Surface Mount: YES

Allows for easy and convenient installation onto PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.8 V

Can handle higher voltage inputs, providing flexibility in various electronic circuit designs.

Package Shape: SQUARE

Compact shape allows for efficient use of space on the PCB.

Maximum Transmit Delay: 0.32 ns

Fast transmission delay ensures quick data transfer, suitable for time-sensitive applications.

No. of Terminals: 8

Sufficient number of terminals for connecting to other components in the circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact size and thin profile save space on the PCB, while shrink pitch reduces the overall size of the package.

Minimum Supply Voltage: 2.375 V

Can operate at low supply voltages, making it suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in various environmental conditions.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for applications in colder climates.

Terminal Finish: TIN

Tin finish provides good conductivity and solderability for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in mounting orientation on the PCB.

Maximum Seated Height: 1.1 mm

Low profile design helps in minimizing the overall height of the circuit board.

Width: 3 mm

Compact width for efficient use of PCB space.

Differential Output: YES

Differential output helps in reducing noise and interference in the signal, ensuring high-quality data transmission.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient duration during the soldering process.

Peak Reflow Temperature °C: 260

Can handle high reflow temperatures during the soldering process.

Length: 3 mm

Compact length for efficient use of PCB space.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where reliability and durability are crucial.

Maximum Receive Delay: 0 ns

Zero receive delay ensures minimal latency in receiving data, making it ideal for real-time applications.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering onto the PCB.

Input Characteristics: DIFFERENTIAL

Differential input helps in improving noise immunity and signal integrity.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent performance.

Terminal Pitch: 0.65 mm

Narrow terminal pitch for high-density mounting on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product has a moderate sensitivity to moisture, requiring proper handling during storage and assembly.

Interface IC Type: LINE TRANSCEIVER

Specific IC type designed for transmitting and receiving signals over communication lines, ensuring reliable data exchange.

Technical Specifications

Line Drivers & Receivers MC10LVEP16DTG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -2.375 V TO -3.8 V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.32 ns

Width:

3 mm

Trade Compliance

MC10LVEP16DTG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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