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MC10LVEL40DWR2G

Onsemi

MC10LVEL40DWR2G by Onsemi

MC10LVEL40DWR2G by Onsemi is a PLL & Frequency Synthesis Circuit with 20 terminals, operating at -40 to 85 °C. It has a supply voltage range of 3-5V and is surface mountable. Ideal for industrial applications requiring phase detection and operates on a nominal 3.3V supply.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,646 parts In-Stock

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Vyrian

USA . 353 parts In-Stock

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Problanco Electronics

Mexico . 7,207 parts In-Stock

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TANS Electronics

Latvia . 4,861 parts In-Stock

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Kulean Microsystems

USA . 2,088 parts In-Stock

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SupplyDigital Components

Austria . 1,345 parts In-Stock

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UHIMA Technologies

Türkiye . 549 parts In-Stock

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Corohmni

South Africa . 256 parts In-Stock

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Corphita

USA . 147 parts In-Stock

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Overview

Experience unmatched precision and reliability with the MC10LVEL40DWR2G by Onsemi. As a leading manufacturer in Phase Locked Loops (PLL) & Frequency Synthesis Circuits, Onsemi delivers top-notch quality and performance that exceeds industry standards. This versatile product is ideal for a wide range of applications, offering customers seamless integration and enhanced functionality. Trust Onsemi to provide you with innovative solutions that drive success and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility to the package, making it suitable for a wide range of environments and applications.

Surface Mount: YES

Surface mount technology allows for easy and compact integration of the component onto PCBs, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V is common and compatible with many electronic systems, making this product versatile and widely applicable.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high temperature environments and ensure reliable performance under harsh conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this product suitable for use in extreme cold environments.

Terminal Finish: MATTE TIN

The matte tin finish on the terminals provides good solderability and corrosion resistance, ensuring reliable electrical connections.

Width (mm): 7.5 mm

The compact width of 7.5mm allows for easy placement in tight spaces or densely populated PCBs, optimizing the layout and design of electronic systems.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V ensures compatibility with a wide range of power sources and allows for flexibility in system design.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering, enhancing the reliability and manufacturability of the product.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this product can handle higher voltage inputs without risking damage, increasing its versatility and robustness.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits MC10LVEL40DWR2G attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Onsemi

Specs

Additional Features:

NECL MODE : VCC = 0V WITH VEE = -3V TO -5.5V

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

MC10LVEL40DWR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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