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MC100EP40DTR2

Onsemi

MC100EP40DTR2 by Onsemi

MC100EP40DTR2 by Onsemi is a PLL & Frequency Synthesis Circuit with 20 terminals, operating at -40 to 85 °C. It has a supply voltage range of 3-5.5V and package dimensions of 6.5mm x 4.4mm, suitable for industrial temperature-grade applications requiring phase detection and ECL100K technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,013 parts In-Stock

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Digiode

USA . 435 parts In-Stock

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435

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Sensible Micro Corp

USA . 3 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$2.176

100+ parts

$1.980

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$1.784

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500

$2.176

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$1.784

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AZTECH Wire

Italy . 524 parts In-Stock

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$17.000

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Kulean Microsystems

USA . 6,582 parts In-Stock

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TANS Electronics

Latvia . 6,385 parts In-Stock

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Problanco Electronics

Mexico . 5,844 parts In-Stock

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SupplyDigital Components

Austria . 4,654 parts In-Stock

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Corphita

USA . 1,978 parts In-Stock

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UHIMA Technologies

Türkiye . 631 parts In-Stock

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Microchip USA

USA . 163 parts In-Stock

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Corohmni

South Africa . 76 parts In-Stock

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Overview

Enhance your frequency synthesis circuits with the MC100EP40DTR2 by Onsemi. Designed with precision and quality in mind, this PLL device offers unparalleled performance in a compact package. With a wide operating temperature range and multiple power supply options, this product is versatile and reliable for a variety of applications. Trust Onsemi's expertise in manufacturing to deliver a top-notch component that will elevate your projects to the next level. Experience the value and benefits of the MC100EP40DTR2 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, making the product resistant to physical damage.

Surface Mount: YES

Surface mount technology makes installation and soldering easier and more efficient.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a nominal voltage of 3.3V ensures compatibility with a wide range of electronic systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the product to function reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can operate in cold environments without issues.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring optimal performance and longevity.

Technology: ECL100K

Utilizing ECL (Emitter-Coupled Logic) technology offers high-speed performance and low power consumption.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits MC100EP40DTR2 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Onsemi

Specs

Additional Features:

NECL MODE : VCC = 0V WITH VEE = -3V TO -5.5V

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3/-5.5/3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

ECL100K

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

MC100EP40DTR2 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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