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MC10LVEL40DW

Onsemi

MC10LVEL40DW by Onsemi

MC10LVEL40DW by Onsemi is a Phase Locked Loop (PLL) IC with 20 terminals, operating at 3.3V/5V. It has a temp range of -40 to 85 °C and terminal finish of Tin Lead. Widely used in frequency synthesis circuits due to its small outline package and industrial temperature grade suitability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,422 parts In-Stock

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Vyrian

USA . 176 parts In-Stock

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TANS Electronics

Latvia . 5,270 parts In-Stock

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5,270

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SupplyDigital Components

Austria . 3,611 parts In-Stock

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Corphita

USA . 1,128 parts In-Stock

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UHIMA Technologies

Türkiye . 712 parts In-Stock

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712

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Corohmni

South Africa . 428 parts In-Stock

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Kulean Microsystems

USA . 422 parts In-Stock

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Problanco Electronics

Mexico . 266 parts In-Stock

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Overview

Unlock the power of precision with the MC10LVEL40DW by Onsemi. Crafted with top-tier quality and expertise, this Phase Locked Loops (PLL) & Frequency Synthesis Circuits device is designed to elevate your projects to new heights. Whether you're working on telecommunications, data communications, or networking applications, this product offers unbeatable value, benefits, and advantages. Trust in Onsemi's reputation for excellence and choose the MC10LVEL40DW for unparalleled performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and reliability for the package, ensuring long-term performance of the product.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into electronic circuits, saving time and effort during manufacturing.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a low nominal supply voltage of 3.3V helps in reducing power consumption and heat generation, making the product energy efficient.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can operate reliably in various industrial environments without overheating.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures good solderability and conductivity, enhancing the overall performance and reliability of the product.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits MC10LVEL40DW attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Onsemi

Specs

Additional Features:

NECL MODE : VCC = 0V WITH VEE = -3V TO -5.5V

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

MC10LVEL40DW Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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