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MC10H141FNR2G

Onsemi

MC10H141FNR2G by Onsemi

MC10H141FNR2G by Onsemi is a 4-bit digital shift register with 2ns propagation delay. It operates b/w 0-75 °C, has a max frequency of 250MHz, and uses ECL technology. Ideal for applications requiring bidirectional count direction and positive edge trigger type in commercial extended temperature grade environments.

Median Price

$7.787

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,920 parts In-Stock

1+ parts

-

100+ parts

$6.230

1k+ parts

$5.580

10k+ parts

$5.250

1,920

-

$6.230

$5.580

$5.250

DigiKey

USA . 1,920 parts In-Stock

1+ parts

-

100+ parts

$8.200

1k+ parts

-

10k+ parts

-

1,920

-

$8.200

-

-

Verical

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

$7.787

1k+ parts

$6.975

10k+ parts

$6.563

1,500

-

$7.787

$6.975

$6.563

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,789 parts In-Stock

1+ parts

$6.593

100+ parts

-

1k+ parts

-

10k+ parts

-

1,789

$6.593

-

-

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Vyrian

USA . 8,101 parts In-Stock

1+ parts

-

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8,101

-

-

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Distributors (Availability)

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Corphita

USA . 1,226 parts In-Stock

1+ parts

$6.246

100+ parts

-

1k+ parts

-

10k+ parts

-

1,226

$6.246

-

-

-

Corohmni

South Africa . 482 parts In-Stock

1+ parts

$6.940

100+ parts

-

1k+ parts

-

10k+ parts

-

482

$6.940

-

-

-

Component Stockers USA

USA . 2,563 parts In-Stock

1+ parts

$7.120

100+ parts

$6.690

1k+ parts

$6.060

10k+ parts

-

2,563

$7.120

$6.690

$6.060

-

AZTECH Wire

Italy . 337 parts In-Stock

1+ parts

$18.210

100+ parts

-

1k+ parts

-

10k+ parts

-

337

$18.210

-

-

-

Advanced Electronics

New Zealand . 83 parts In-Stock

1+ parts

$23.768

100+ parts

$21.629

1k+ parts

$19.490

10k+ parts

-

83

$23.768

$21.629

$19.490

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Kulean Microsystems

USA . 7,970 parts In-Stock

1+ parts

-

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7,970

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Microchip USA

USA . 5,095 parts In-Stock

1+ parts

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5,095

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TANS Electronics

Latvia . 4,794 parts In-Stock

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4,794

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SupplyDigital Components

Austria . 2,115 parts In-Stock

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2,115

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Problanco Electronics

Mexico . 853 parts In-Stock

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853

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UHIMA Technologies

Türkiye . 79 parts In-Stock

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79

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Overview

Unleash the power of digital shift registers with the MC10H141FNR2G by Onsemi! This high-quality product offers unparalleled precision and speed, making it perfect for a wide range of applications. Onsemi's reputation for excellence ensures reliability and durability, giving you peace of mind knowing you're investing in a superior product. Experience seamless performance and efficiency with the MC10H141FNR2G, providing you with the value and benefits you need to stay ahead in today's fast-paced world. Elevate your projects with this innovative solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the product, making it suitable for various applications.

No. of Bits: 4

Having 4 bits allows for a higher level of data processing and control, making this shift register versatile and efficient.

Propagation Delay (tpd): 2 ns

The low propagation delay of 2 ns ensures fast and efficient signal processing, making this shift register ideal for time-sensitive applications.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature of 75 °C, this shift register can withstand demanding environmental conditions.

Technology: ECL

The use of ECL technology ensures high-speed operation and low power consumption, making this shift register an excellent choice for high-performance applications.

Technical Specifications

Digital Shift Registers MC10H141FNR2G attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

Count Direction:

BIDIRECTIONAL

Family:

10H

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

250000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

2 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Shift Registers

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

8.965 mm

Minimum fmax:

250 MHz

Trade Compliance

MC10H141FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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