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MC100E142FNG

Onsemi

MC100E142FNG by Onsemi

MC100E142FNG by Onsemi is a 9-bit digital shift register with 1ns propagation delay. Operating at 700MHz, it has a supply voltage range of 4.2V to 5.7V and triggers on positive edge. Ideal for high-speed data transfer applications in electronics due to its ECL technology and compact chip carrier package design.

Median Price

$7.729

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 129 parts In-Stock

1+ parts

-

100+ parts

$6.870

1k+ parts

$6.150

10k+ parts

$5.780

129

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$6.870

$6.150

$5.780

Verical

USA . 114 parts In-Stock

1+ parts

-

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$8.588

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114

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$8.588

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Distributors (In-Stock)

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Digiode

USA . 474 parts In-Stock

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$7.258

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474

$7.258

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Vyrian

USA . 2,986 parts In-Stock

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2,986

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Inventory MP

USA . 79 parts In-Stock

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79

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Bristol Electronics

USA . 79 parts In-Stock

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79

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Distributors (Availability)

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Corphita

USA . 2,117 parts In-Stock

1+ parts

$6.876

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2,117

$6.876

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Corohmni

South Africa . 389 parts In-Stock

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$7.640

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389

$7.640

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AZTECH Wire

Italy . 1,082 parts In-Stock

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$20.140

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1,082

$20.140

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Kulean Microsystems

USA . 6,888 parts In-Stock

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6,888

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SupplyDigital Components

Austria . 5,196 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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TANS Electronics

Latvia . 3,033 parts In-Stock

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Microchip USA

USA . 2,991 parts In-Stock

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Problanco Electronics

Mexico . 1,216 parts In-Stock

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UHIMA Technologies

Türkiye . 981 parts In-Stock

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Continental Prestige Electronics

USA . 129 parts In-Stock

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129

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Overview

Unleash the power of digital shift registers with the MC100E142FNG by Onsemi. Crafted with precision and expertise, this innovative product offers unmatched quality and reliability. Ideal for a wide range of applications, from telecommunications to industrial automation, this square-shaped chip carrier is designed to enhance performance and efficiency. With a nominal supply voltage of 5V and a propagation delay of just 1ns, this device delivers lightning-fast results. Elevate your projects with the MC100E142FNG and experience the unparalleled value and benefits it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on PCBs, saving space and simplifying assembly processes.

No. of Bits: 9

This 9-bit shift register allows for complex data manipulation and storage, providing versatility in digital circuit design.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with common power sources and facilitates integration into existing systems.

Propagation Delay (tpd): 1 ns

The low propagation delay of 1ns enables fast data transfer and processing, making this shift register suitable for high-speed applications.

Maximum Frequency At Nominal Supply: 700000000 Hz

With a maximum frequency of 700MHz at the nominal supply voltage, this shift register can handle high-speed data processing requirements with ease.

Technology: ECL

The ECL technology employed in this shift register offers high-speed operation and low power consumption, making it a reliable choice for demanding applications.

Technical Specifications

Digital Shift Registers MC100E142FNG attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V; SIPO OPERATION ALSO AVAILABLE

Count Direction:

RIGHT

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

700000000 Hz

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Propagation Delay (tpd):

1 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trigger Type:

POSITIVE EDGE

Width:

11.505 mm

Minimum fmax:

700 MHz

Trade Compliance

MC100E142FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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