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MC100E445FN

Onsemi

MC100E445FN by Onsemi

MC100E445FN by Onsemi is a 4-bit digital shift register with a propagation delay of 2.1 ns and operates on ECL technology. It has a supply voltage range of 4.2V to 5.7V, making it suitable for high-speed applications requiring precise timing control at temperatures ranging from 0 °C to 85°C. The chip carrier package style with surface mount feature makes it ideal for compact electronic designs in various industries.

Median Price

$9.548

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (In-Stock)

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Ace Electronics

USA . 1 parts In-Stock

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$7.500

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$7.500

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Freelance Electronics

USA . 36 parts In-Stock

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$11.596

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$12.176

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$11.480

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36

$11.596

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$11.480

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Vyrian

USA . 1,779 parts In-Stock

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Digiode

USA . 1,537 parts In-Stock

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Electronic Expediters

USA . 55 parts In-Stock

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Elcom Components

USA . 26 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 26 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 24 parts In-Stock

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ComSIT Distribution GmbH

Germany . 12 parts In-Stock

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Sunrise Surplus Inc.

USA . 10 parts In-Stock

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Speed Components Ltd

Israel . 8 parts In-Stock

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Bristol Electronics

USA . 7 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 4 parts In-Stock

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Inland Empire Components Inc.

USA . 1 parts In-Stock

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Corohmni

South Africa . 182 parts In-Stock

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$7.500

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Component Stockers USA

USA . 355 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 21,607 parts In-Stock

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SupplyDigital Components

Austria . 6,990 parts In-Stock

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Kulean Microsystems

USA . 6,911 parts In-Stock

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TANS Electronics

Latvia . 1,861 parts In-Stock

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Corphita

USA . 1,615 parts In-Stock

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Problanco Electronics

Mexico . 875 parts In-Stock

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Microchip USA

USA . 403 parts In-Stock

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UHIMA Technologies

Türkiye . 33 parts In-Stock

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Assy Fe

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Overview

Experience the superior quality and reliability of Onsemi with the MC100E445FN digital shift register. This innovative product offers customers a seamless solution for their applications, providing precise and efficient data shifting capabilities. With a focus on value and performance, this chip carrier package ensures ease of use and compatibility in various electronics projects. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to heat, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

No. of Bits: 4

Ideal for applications requiring a small number of bits, providing simplicity and cost-effectiveness.

Nominal Supply Voltage: 5V

Compatible with standard electronic systems and power sources, ensuring easy integration.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for a variety of environments and applications.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, making the product efficient and reliable.

Technical Specifications

Digital Shift Registers MC100E445FN attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2 TO -5.7V

Count Direction:

RIGHT

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Propagation Delay (tpd):

2.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

11.505 mm

Minimum fmax:

2000 MHz

Trade Compliance

MC100E445FN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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