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MC10EP89DR2

Onsemi

MC10EP89DR2 by Onsemi

MC10EP89DR2 by Onsemi is a Line Driver with 8 terminals, ECL technology, and differential output. It operates at -40 to 85 °C with a supply voltage range of 3-5.5 V. Ideal for industrial applications requiring fast signal transmission with minimal delay.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,951 parts In-Stock

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R&J Components

USA . 2,220 parts In-Stock

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Digiode

USA . 1,670 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 658 parts In-Stock

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$20.060

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658

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TANS Electronics

Latvia . 8,027 parts In-Stock

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SupplyDigital Components

Austria . 7,707 parts In-Stock

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Kulean Microsystems

USA . 4,111 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 2,354 parts In-Stock

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Corphita

USA . 1,671 parts In-Stock

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Kepictronics

USA . 612 parts In-Stock

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Corohmni

South Africa . 347 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 207 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the MC10EP89DR2 by Onsemi. Crafted with precision and expertise, this line driver & receiver boasts unparalleled quality and reliability. Ideal for a range of applications, this product offers customers unmatched value, speed, and efficiency. Say goodbye to delays and welcome a new era of connectivity with the MC10EP89DR2. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Can handle a wide range of input voltages, making it versatile.

Package Shape: RECTANGULAR

Fits well in standard circuit board layouts.

Maximum Transmit Delay: 0.37 ns

Ensures fast signal transmission, ideal for high-speed applications.

Power Supplies (V): -5.2

Provides a stable negative power supply for reliable operation.

No. of Terminals: 8

Allows for multiple connections for transmitting and receiving signals.

Package Style (Meter): SMALL OUTLINE

Saves space on the circuit board, ideal for compact designs.

Maximum High Level Input Current: 0.00015 Amp

Efficiently handles high input currents for reliable signal processing.

Minimum Supply Voltage: 3 V

Operates at low voltage levels, suitable for various applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Capable of operating in low temperature settings, providing reliable performance in harsh conditions.

Terminal Finish: TIN LEAD

Provides a reliable electrical connection for improved signal transmission.

Terminal Position: DUAL

Allows for versatile connection options.

Maximum Seated Height: 1.75 mm

Low-profile design for compact systems.

Width: 3.9 mm

Compact size for efficient use of space on the circuit board.

Differential Output: YES

Provides accurate signal transmission and noise immunity.

Peak Reflow Temperature °C: 235

Can withstand high temperatures during the assembly process.

Length: 4.9 mm

Compact size for space-saving installations.

Minimum Out Swing: 1.4 V

Ensures reliable output swing for consistent signal integrity.

Temperature Grade: INDUSTRIAL

Suitable for demanding industrial environments.

Maximum Receive Delay: 0 ns

Minimizes delays in receiving signals, ensuring real-time communication.

Technology: ECL

Utilizes Emitter-Coupled Logic for high-speed operation.

Terminal Form: GULL WING

Facilitates easy soldering and connection with circuit boards.

Input Characteristics: DIFFERENTIAL

Allows for accurate signal processing with noise rejection.

Nominal Supply Voltage: 3.3 V

Optimal voltage level for stable operation.

Nominal Negative Supply Voltage: -5.2 V

Provides a reliable negative power supply for consistent performance.

Terminal Pitch: 1.27 mm

Standard pitch for compatibility with existing circuit board layouts.

Interface IC Type: LINE DRIVER

Specifically designed for driving signals over long distances with minimal distortion.

Technical Specifications

Line Drivers & Receivers MC10EP89DR2 attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00015 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.4 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

.37 ns

Width:

3.9 mm

Trade Compliance

MC10EP89DR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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