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MC10EP17DTR2G

Onsemi

MC10EP17DTR2G by Onsemi

MC10EP17DTR2G by Onsemi is a Line Transceiver with 4 functions, operating at -40 to 85 °C. It has a max supply voltage of 5.5 V and differential output capability. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,812 parts In-Stock

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Digiode

USA . 823 parts In-Stock

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AZTECH Wire

Italy . 413 parts In-Stock

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$22.020

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Component Stockers USA

USA . 432 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 7,754 parts In-Stock

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Kulean Microsystems

USA . 6,968 parts In-Stock

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Problanco Electronics

Mexico . 4,882 parts In-Stock

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TANS Electronics

Latvia . 1,802 parts In-Stock

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Corphita

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Microchip USA

USA . 479 parts In-Stock

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Corohmni

South Africa . 249 parts In-Stock

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UHIMA Technologies

Türkiye . 103 parts In-Stock

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Overview

Unlock unparalleled performance with the MC10EP17DTR2G from Onsemi, a leading manufacturer in line drivers & receivers. This high-quality product boasts advanced technology and precise engineering, making it ideal for a wide range of applications. Experience lightning-fast data transmission, reliable signal integrity, and seamless connectivity with this versatile device. Trust Onsemi to deliver cutting-edge solutions that exceed expectations and add exceptional value to your projects. Elevate your designs with the MC10EP17DTR2G and unleash the full potential of your systems.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

Provides durability and protection for the internal components.

Surface Mount - YES

Allows for easy mounting on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage - 5.5 V

Can handle a wide range of supply voltages, making it versatile for different applications.

No. of Functions - 4

Offers multiple functions in a single package, reducing the need for additional components.

Maximum Transmit Delay - 0.3 ns

Provides fast data transmission for efficient communication.

Minimum Operating Temperature -40 °C

Can operate in extreme cold temperatures, suitable for various environmental conditions.

Length - 6.5 mm

Compact size allows for space-saving installation in tight areas.

Technology - ECL

Utilizes Emitter-Coupled Logic for high-speed and low-power operation.

Technical Specifications

Line Drivers & Receivers MC10EP17DTR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

4

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.0/-5.5

Qualification:

Not Qualified

Maximum Receive Delay:

.3 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

62 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.3 ns

Width:

4.4 mm

Trade Compliance

MC10EP17DTR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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