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MC10EP16VADG

Onsemi

MC10EP16VADG by Onsemi

MC10EP16VADG by Onsemi is a Line Driver with 8 terminals, operating at -40 to 85 °C. It has a max transmit delay of 0.34 ns and differential output. Ideal for industrial applications requiring ECL technology and a supply voltage range of 3-5.5 V.

Median Price

$3.740

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 8 parts In-Stock

1+ parts

$2.430

100+ parts

-

1k+ parts

-

10k+ parts

-

8

$2.430

-

-

-

Rochester

USA . 29,990 parts In-Stock

1+ parts

-

100+ parts

$3.740

1k+ parts

$3.350

10k+ parts

$3.150

29,990

-

$3.740

$3.350

$3.150

Verical

USA . 78 parts In-Stock

1+ parts

-

100+ parts

$4.925

1k+ parts

-

10k+ parts

-

78

-

$4.925

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 120 parts In-Stock

1+ parts

$2.242

100+ parts

-

1k+ parts

-

10k+ parts

-

120

$2.242

-

-

-

Vyrian

USA . 2,682 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,682

-

-

-

-

Semi Source

USA . 19 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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19

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 229 parts In-Stock

1+ parts

$2.124

100+ parts

-

1k+ parts

-

10k+ parts

-

229

$2.124

-

-

-

Corohmni

South Africa . 453 parts In-Stock

1+ parts

$2.440

100+ parts

-

1k+ parts

-

10k+ parts

-

453

$2.440

-

-

-

AZTECH Wire

Italy . 115 parts In-Stock

1+ parts

$14.390

100+ parts

-

1k+ parts

-

10k+ parts

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115

$14.390

-

-

-

Continental Prestige Electronics

USA . 30,410 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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30,410

-

-

-

-

TANS Electronics

Latvia . 6,994 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,994

-

-

-

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SupplyDigital Components

Austria . 5,619 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,619

-

-

-

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Kulean Microsystems

USA . 4,671 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,671

-

-

-

-

Problanco Electronics

Mexico . 3,085 parts In-Stock

1+ parts

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100+ parts

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3,085

-

-

-

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Microchip USA

USA . 175 parts In-Stock

1+ parts

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175

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Perfect Parts

USA . 147 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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147

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-

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UHIMA Technologies

Türkiye . 117 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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117

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-

-

-

Overview

Enhance your electronic designs with the MC10EP16VADG line driver and receiver by Onsemi. Crafted from high-quality materials, this innovative product offers superior performance and reliability for a wide range of applications. Whether you're working on telecommunications, industrial control systems, or data communication projects, this compact and efficient device delivers unmatched value, precision, and speed. Trust Onsemi's expertise and experience in semiconductor technology to elevate your projects to the next level with the MC10EP16VADG. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials makes the product lightweight and durable, perfect for portable applications.

Surface Mount: YES

Allows for easy and secure installation on a circuit board, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Can handle high supply voltages, providing versatility in various electronic systems.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on a circuit board and space-saving design.

Maximum Transmit Delay: 0.34 ns

Provides fast and precise signal transmission, crucial for high-speed data communication.

Power Supplies (V): -5.2

Can operate with negative supply voltage, suitable for certain electronic applications that require dual power supplies.

No. of Terminals: 8

Offers sufficient connection points for interfacing with other components, ensuring compatibility and flexibility.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in conserving space on the PCB and allows for densely packed circuitry.

Maximum High Level Input Current: 0.00015 Amp

Low input current requirement helps in minimizing power consumption and reducing overall system heat dissipation.

Minimum Supply Voltage: 3 V

Works efficiently even at low supply voltages, making it suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliability in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold temperatures, making it suitable for outdoor or industrial applications.

Terminal Finish: TIN

Tin finish provides good conductivity and solderability, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options and flexibility in circuit design.

Maximum Seated Height: 1.75 mm

Low profile design helps in fitting the product in compact spaces and enhances PCB layout flexibility.

Width: 3.9 mm

Narrow width saves PCB real estate and allows for compact system designs.

Differential Output: YES

Differential outputs help in noise rejection and signal integrity, crucial for high-speed data transmission.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes, ensuring reliable and durable connections during assembly.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with extended temperature ranges and rugged environments.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, ideal for high-speed signal processing.

Terminal Form: GULL WING

Gull wing terminals provide secure mechanical support and ease of soldering during assembly.

Maximum Supply Current: 40 mA

Low supply current requirement helps in reducing power consumption and heat dissipation in the system.

Input Characteristics: DIFFERENTIAL

Differential input characteristics help in noise rejection and signal integrity, critical for reliable data communication.

Nominal Supply Voltage: 3.3 V

Stable and reliable supply voltage for consistent performance in various electronic systems.

Nominal Negative Supply Voltage: -5.2 V

Provides a stable and efficient negative supply voltage for certain electronic applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy assembly and compatibility with common PCB layouts.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type enables bidirectional data transmission and reception, essential for communication systems.

Technical Specifications

Line Drivers & Receivers MC10EP16VADG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00015 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Receive Delay:

.34 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.34 ns

Width:

3.9 mm

Trade Compliance

MC10EP16VADG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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