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MC10EP16DTR2

Onsemi

MC10EP16DTR2 by Onsemi

MC10EP16DTR2 by Onsemi is a Line Transceiver with ECL technology. It operates at -40 to 85 °C, with 3-5.5 V supply voltage range and 32 mA max current. Ideal for applications requiring high-speed data transmission in industrial settings due to its differential output and low transmit delay of 0.28 ns.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,646 parts In-Stock

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11,646

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Quantum Digital Technology

USA . 2,996 parts In-Stock

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2,996

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Digiode

USA . 2,016 parts In-Stock

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2,016

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Distributors (Availability)

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AZTECH Wire

Italy . 128 parts In-Stock

1+ parts

$21.530

100+ parts

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128

$21.530

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Component Stockers USA

USA . 564 parts In-Stock

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$99.990

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564

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 13,321 parts In-Stock

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13,321

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SupplyDigital Components

Austria . 6,112 parts In-Stock

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6,112

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Microchip USA

USA . 4,717 parts In-Stock

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Kulean Microsystems

USA . 3,062 parts In-Stock

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3,062

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Corphita

USA . 2,299 parts In-Stock

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2,299

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Problanco Electronics

Mexico . 1,681 parts In-Stock

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1,681

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TANS Electronics

Latvia . 1,500 parts In-Stock

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1,500

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Corohmni

South Africa . 483 parts In-Stock

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483

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UHIMA Technologies

Türkiye . 303 parts In-Stock

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303

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Overview

Enhance your electronic systems with the MC10EP16DTR2 by Onsemi, a top-quality line driver & receiver designed for reliability and performance. Onsemi's reputation for excellence shines through in this product, offering customers unparalleled value and benefits. With applications ranging from telecommunications to data communications, this small outline, thin profile component ensures seamless transmission with its differential output and ECL technology. Experience precision and efficiency with the MC10EP16DTR2, the perfect choice for industrial-grade operations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mountable design allows for easy installation on PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, providing flexibility in various applications.

Package Shape: RECTANGULAR

Rectangular shape enables efficient use of space on the PCB and allows for easy integration into existing designs.

Maximum Transmit Delay: 0.28 ns

Ultra-low transmit delay ensures fast and reliable data transmission, ideal for high-speed communication requirements.

Power Supplies (V): -5.2

Support for negative power supplies allows for versatility in power configurations, enhancing compatibility with different systems.

No. of Terminals: 8

Sufficient number of terminals for connectivity requirements, enabling easy interfacing with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with thin profile and shrink pitch saves space on the PCB, making it suitable for applications with size constraints.

Minimum Supply Voltage: 3 V

Low minimum supply voltage allows for operation in low-power environments, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in demanding environmental conditions, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures functionality in extreme cold environments, enhancing versatility.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB mounting orientations, simplifying installation and PCB layout.

Maximum Seated Height: 1.1 mm

Low seated height saves vertical space on the PCB, making it suitable for compact designs.

Width: 3 mm

Narrow width allows for dense packing of components on the PCB, ideal for applications with limited space.

Differential Output: YES

Differential output reduces noise and increases signal fidelity, improving overall signal integrity in communication systems.

Peak Reflow Temperature °C: 235

High peak reflow temperature tolerance ensures reliable soldering during manufacturing processes, reducing assembly failures.

Length: 3 mm

Compact length saves space on the PCB and allows for efficient routing of signal traces.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures operability in harsh environmental conditions, making it suitable for industrial applications.

Maximum Receive Delay: 0.28 ns

Ultra-low receive delay contributes to fast data reception, enhancing overall system performance.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, making it suitable for high-performance applications.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and secure solder joints, ensuring long-term reliability.

Maximum Supply Current: 32 mA

Low supply current consumption minimizes power consumption and heat dissipation, improving energy efficiency.

Input Characteristics: DIFFERENTIAL

Differential input improves noise immunity and common-mode rejection, enhancing signal integrity in noisy environments.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Nominal Negative Supply Voltage: -5.2 V

Stable nominal negative supply voltage allows for proper biasing and operation of the device, ensuring reliable performance.

Terminal Pitch: 0.65 mm

Fine terminal pitch enables high-density mounting on the PCB, suitable for applications with limited space.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type facilitates bidirectional communication between different systems, enhancing versatility and interoperability.

Technical Specifications

Line Drivers & Receivers MC10EP16DTR2 attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Receive Delay:

.28 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

32 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

.28 ns

Width:

3 mm

Trade Compliance

MC10EP16DTR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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