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MC10EP116FAR2

Onsemi

MC10EP116FAR2 by Onsemi

LINE TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;

Median Price

$7.487

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$5.990

1k+ parts

$5.360

10k+ parts

$5.050

4,000

-

$5.990

$5.360

$5.050

DigiKey

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$7.890

1k+ parts

-

10k+ parts

-

4,000

-

$7.890

-

-

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$7.487

1k+ parts

$6.700

10k+ parts

$6.313

4,000

-

$7.487

$6.700

$6.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 479 parts In-Stock

1+ parts

$6.336

100+ parts

-

1k+ parts

-

10k+ parts

-

479

$6.336

-

-

-

Vyrian

USA . 10,358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,358

-

-

-

-

Electronic Expediters

USA . 5,114 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,114

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 525 parts In-Stock

1+ parts

$6.003

100+ parts

-

1k+ parts

-

10k+ parts

-

525

$6.003

-

-

-

Corohmni

South Africa . 397 parts In-Stock

1+ parts

$6.010

100+ parts

-

1k+ parts

-

10k+ parts

-

397

$6.010

-

-

-

Component Stockers USA

USA . 5,888 parts In-Stock

1+ parts

$6.750

100+ parts

$6.350

1k+ parts

$5.740

10k+ parts

-

5,888

$6.750

$6.350

$5.740

-

AZTECH Wire

Italy . 89 parts In-Stock

1+ parts

$20.030

100+ parts

-

1k+ parts

-

10k+ parts

-

89

$20.030

-

-

-

SupplyDigital Components

Austria . 7,796 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,796

-

-

-

-

Kulean Microsystems

USA . 4,425 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,425

-

-

-

-

Continental Prestige Electronics

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.010

10k+ parts

-

4,000

-

-

$6.010

-

Problanco Electronics

Mexico . 2,120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,120

-

-

-

-

TANS Electronics

Latvia . 1,264 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,264

-

-

-

-

Microchip USA

USA . 236 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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236

-

-

-

-

UHIMA Technologies

Türkiye . 133 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

133

-

-

-

-

Technical Specifications

Line Drivers & Receivers MC10EP116FAR2 attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

6

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e0

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

6

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Receive Delay:

.34 ns

Receiver No. of Bits:

6

Maximum Seated Height:

1.6 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

95 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Transmit Delay:

.34 ns

Width:

7 mm

Trade Compliance

MC10EP116FAR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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