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MC10E416FNR2G

Onsemi

MC10E416FNR2G by Onsemi

MC10E416FNR2G by Onsemi is a Line Receiver IC with 5 functions, operating at -5.2V to 5.7V voltage range. Utilizes ECL technology for differential input characteristics, ideal for high-speed communication applications requiring low receive delay and differential output. Package style is chip carrier with 28 terminals in a square shape, suitable for surface mount assembly.

Median Price

$6.230

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$5.550

1k+ parts

$4.960

10k+ parts

$4.670

500

-

$5.550

$4.960

$4.670

Avnet

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$6.230

1k+ parts

$5.700

10k+ parts

-

500

-

$6.230

$5.700

-

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$6.938

1k+ parts

$6.200

10k+ parts

$5.838

500

-

$6.938

$6.200

$5.838

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,955 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,955

-

-

-

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Digiode

USA . 2,086 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,086

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 413 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

413

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 127 parts In-Stock

1+ parts

$5.560

100+ parts

-

1k+ parts

-

10k+ parts

-

127

$5.560

-

-

-

Component Stockers USA

USA . 535 parts In-Stock

1+ parts

$6.360

100+ parts

$5.980

1k+ parts

-

10k+ parts

-

535

$6.360

$5.980

-

-

AZTECH Wire

Italy . 937 parts In-Stock

1+ parts

$17.600

100+ parts

-

1k+ parts

-

10k+ parts

-

937

$17.600

-

-

-

SupplyDigital Components

Austria . 7,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,980

-

-

-

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Kulean Microsystems

USA . 4,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,240

-

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 2,695 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,695

-

-

-

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Problanco Electronics

Mexico . 2,524 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,524

-

-

-

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TANS Electronics

Latvia . 2,324 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,324

-

-

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Corphita

USA . 2,256 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,256

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-

-

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Continental Prestige Electronics

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$5.560

1k+ parts

-

10k+ parts

-

500

-

$5.560

-

-

UHIMA Technologies

Türkiye . 466 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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466

-

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Authorized Procurement Solutions

USA . 413 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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413

-

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Microchip USA

USA . 363 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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363

-

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-

-

Overview

Experience the superior quality and performance of the MC10E416FNR2G by Onsemi, a leading manufacturer in the industry. This line driver & receiver offers unmatched reliability and efficiency, making it ideal for a wide range of applications. From telecommunications to industrial control systems, this product delivers exceptional value and benefits to customers. Stay ahead of the competition with the cutting-edge technology and advanced features of the MC10E416FNR2G. Elevate your projects with this innovative solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and commonly used in electronic components, ensuring the reliability and longevity of the product.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.7 V

With a higher maximum supply voltage, this product can accommodate a wide range of power sources and be versatile in different applications.

No. of Functions: 5

Having multiple functions in a single component can simplify circuitry design and reduce the need for additional components, saving space and cost.

Package Shape: SQUARE

The square shape of the package helps in efficient layout and placement on the circuit board, optimizing space utilization.

Power Supplies (V): -5.2

The negative power supply voltage of -5.2 allows for compatibility with systems that require both positive and negative voltage sources, increasing versatility.

No. of Terminals: 28

With a higher number of terminals, this product can accommodate complex circuit connections and provide more functionality in a compact form factor.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is known for its compact size and efficient heat dissipation, making it suitable for high-density circuit designs and ensuring reliability.

Minimum Supply Voltage: 4.2 V

The minimum supply voltage of 4.2 V ensures reliable operation even in low-power conditions, making this product suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand harsh environmental conditions and ensure stable performance in various settings.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C ensures reliable operation even in cold environments, making this product suitable for outdoor or industrial applications.

Terminal Finish: TIN

The TIN terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity of the product.

Terminal Position: QUAD

The quad terminal position allows for easy and secure mounting on the circuit board, providing stable connections and reducing the risk of disconnection.

Maximum Seated Height: 4.57 mm

The low maximum seated height of 4.57 mm saves space on the circuit board and allows for compact and efficient designs.

Width: 11.505 mm

The compact width of 11.505 mm enables easy integration into tight spaces and facilitates efficient layout and placement on the circuit board.

Receiver No. of Bits: 5

Having 5 bits in the receiver allows for accurate and reliable data transmission, making this product suitable for high-speed communication applications.

Differential Output: YES

The differential output feature helps in reducing electromagnetic interference and noise in signal transmission, ensuring reliable and high-quality data transmission.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures efficient soldering and reliable connections during assembly.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260 °C, this product can withstand the soldering process without degradation, ensuring durability and reliability.

Length: 11.505 mm

The compact length of 11.505 mm saves space on the circuit board and allows for efficient integration into tight spaces.

Maximum Receive Delay: 0.5 ns

The low maximum receive delay of 0.5 nanoseconds ensures quick and efficient data transmission, making this product suitable for high-speed communication applications.

Technology: ECL

The Emitter-Coupled Logic (ECL) technology offers high-speed operation and low power consumption, making this product suitable for high-performance applications.

Terminal Form: J BEND

The J BEND terminal form provides a secure and reliable connection to the circuit board, ensuring stable and long-lasting performance.

Maximum Supply Current: 162 mA

With a maximum supply current of 162 mA, this product can operate efficiently without drawing excessive power, making it suitable for low-power applications.

Input Characteristics: DIFFERENTIAL

The differential input characteristics help in reducing noise and interference in signal transmission, ensuring reliable and high-quality data reception.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V provides stable power to the component, ensuring reliable operation and compatibility with standard power sources.

Nominal Negative Supply Voltage: -5.2 V

Having a nominal negative supply voltage of -5.2 V allows for compatibility with systems that require both positive and negative voltage sources, increasing versatility.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch provides sufficient spacing for easy soldering and connection, ensuring reliable and secure mounting on the circuit board.

Moisture Sensitivity Level (MSL): 3

With an MSL level of 3, this product can withstand moderate exposure to moisture during assembly and storage, ensuring reliable performance in various environments.

Interface IC Type: LINE RECEIVER

Being a line receiver interface IC type, this product is designed for accurate and reliable data reception in communication systems, making it ideal for high-speed data transmission applications.

Technical Specifications

Line Drivers & Receivers MC10E416FNR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -4.2V TO -5.7V SUPPLY IN NECL MODE

Differential Output:

YES

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

5

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Receive Delay:

.5 ns

Receiver No. of Bits:

5

Maximum Seated Height:

4.57 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

162 mA

Maximum Supply Voltage:

5.7 V

Minimum Supply Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11.505 mm

Trade Compliance

MC10E416FNR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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