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MC10E116FNG

Onsemi

MC10E116FNG by Onsemi

MC10E116FNG by Onsemi is a 5-function line driver with ECL technology. It operates b/w -5.2V to 5.7V, has 28 terminals, and offers differential output. Ideal for applications requiring high-speed data transmission in electronic systems.

Median Price

$10.286

Lifecycle Status

EOL

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 7 parts In-Stock

1+ parts

$7.840

100+ parts

$7.272

1k+ parts

-

10k+ parts

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7

$7.840

$7.272

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DigiKey

USA . 34 parts In-Stock

1+ parts

$11.610

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-

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34

$11.610

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Rochester

USA . 3,965 parts In-Stock

1+ parts

$36.150

100+ parts

$33.980

1k+ parts

$31.810

10k+ parts

-

3,965

$36.150

$33.980

$31.810

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Flip Electronics (Authorized)

USA . 3,256 parts In-Stock

1+ parts

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3,256

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Verical

USA . 2,574 parts In-Stock

1+ parts

-

100+ parts

$8.963

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2,574

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$8.963

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EBV Elektronik

Germany . 74 parts In-Stock

1+ parts

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74

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Distributors (In-Stock)

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Digiode

USA . 2,383 parts In-Stock

1+ parts

$7.448

100+ parts

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2,383

$7.448

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Vyrian

USA . 3,603 parts In-Stock

1+ parts

-

100+ parts

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3,603

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Flip Electronics

USA . 3,256 parts In-Stock

1+ parts

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100+ parts

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3,256

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,428 parts In-Stock

1+ parts

$6.660

100+ parts

-

1k+ parts

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1,428

$6.660

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Corphita

USA . 1,080 parts In-Stock

1+ parts

$7.056

100+ parts

-

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10k+ parts

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1,080

$7.056

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Component Stockers USA

USA . 4,447 parts In-Stock

1+ parts

$7.660

100+ parts

$7.190

1k+ parts

$6.500

10k+ parts

-

4,447

$7.660

$7.190

$6.500

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Corohmni

South Africa . 100 parts In-Stock

1+ parts

$7.840

100+ parts

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100

$7.840

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Microchip USA

USA . 1,697 parts In-Stock

1+ parts

$28.531

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1,697

$28.531

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Kulean Microsystems

USA . 8,110 parts In-Stock

1+ parts

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8,110

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TANS Electronics

Latvia . 6,791 parts In-Stock

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6,791

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Problanco Electronics

Mexico . 6,155 parts In-Stock

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6,155

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SupplyDigital Components

Austria . 1,312 parts In-Stock

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1,312

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UHIMA Technologies

Türkiye . 608 parts In-Stock

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608

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Perfect Parts

USA . 127 parts In-Stock

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127

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Netroflash

USA . 50 parts In-Stock

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50

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Overview

Experience superior quality and reliability with the MC10E116FNG from Onsemi, a leading manufacturer in the industry. This line driver and receiver offers unparalleled performance and precision for a wide range of applications. From data communication to industrial automation, this product ensures seamless connectivity and efficient signal transmission. Trust Onsemi to deliver cutting-edge technology that meets your needs and provides unmatched value. Elevate your projects with the MC10E116FNG today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and insulation, making the product resistant to external influences and ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and enabling more efficient design layouts.

Maximum Supply Voltage: 5.7 V

Can handle high voltage levels, providing flexibility in the power supply options for various applications.

No. of Functions: 5

Offers multiple functions in a single component, reducing the need for additional components and simplifying circuit design.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board, optimizing the layout and improving overall design aesthetics.

Power Supplies (V): -5.2

Provides a negative power supply option, which is essential for certain applications that require dual power supplies for proper operation.

No. of Terminals: 28

Having a higher number of terminals allows for more connections, enabling versatile integration with other components and peripherals.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers enhanced thermal performance and protection, ensuring reliability in demanding operating conditions.

Minimum Supply Voltage: 4.2 V

Works effectively even at lower supply voltages, providing compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for applications where heat dissipation is a concern.

Minimum Operating Temperature: 0 °C

Capable of operating in cold environments, ensuring reliable performance in a variety of temperature conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and good solderability, ensuring secure and long-lasting connections.

Terminal Position: QUAD

Quad terminal position allows for easy PCB mounting and soldering, facilitating efficient assembly processes.

Maximum Seated Height: 4.57 mm

Low seated height enables compact PCB designs, saving space and improving overall system integration.

Width: 11.505 mm

Optimal width dimension for fitting into standard PCB layouts, ensuring compatibility and ease of installation.

Receiver No. of Bits: 5

Supports communication protocols with 5-bit data transmission, suitable for applications requiring a specific number of bits for data exchange.

Differential Output: YES

Differential output configuration provides noise immunity and signal integrity, making it a reliable choice for communication systems.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for a sufficient duration for peak reflow soldering, ensuring proper solder joint formation and component reliability.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during soldering processes, meeting industry standards for lead-free soldering.

Length: 11.505 mm

Suitable length dimension for easy integration and placement on the PCB, optimizing the overall circuit layout.

Maximum Receive Delay: 0.45 ns

Low receive delay ensures fast signal processing and response times, critical for high-speed communication applications.

Technology: ECL

Uses Emitter-Coupled Logic technology known for high-speed operation and low propagation delays, ideal for demanding signal processing tasks.

Terminal Form: J BEND

J-bend terminal form enables secure mechanical connection and easy handling during installation, ensuring reliable electrical contacts.

Maximum Supply Current: 35 mA

Low supply current requirement helps in minimizing power consumption, making it energy-efficient and cost-effective.

Input Characteristics: DIFFERENTIAL

Differential input design offers noise rejection and common-mode interference rejection, enhancing signal quality and reliability.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with common power sources, ensuring easy integration into existing systems.

Nominal Negative Supply Voltage: -5.2 V

Provides a stable negative voltage supply option, essential for proper operation of the component in dual power supply systems.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy PCB layout and soldering, facilitating smooth assembly processes and ensuring proper connections.

Moisture Sensitivity Level (MSL): 3

MSL level indicates the component's resistance to moisture sensitivity during storage and handling, ensuring reliability in various environmental conditions.

Interface IC Type: LINE RECEIVER

Specific interface type designed for receiving line signals, ensuring compatibility and efficient signal processing for communication applications.

Technical Specifications

Line Drivers & Receivers MC10E116FNG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -4.2V TO -5.7V SUPPLY IN NECL MODE

Differential Output:

YES

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

5

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Receive Delay:

.45 ns

Receiver No. of Bits:

5

Maximum Seated Height:

4.57 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

35 mA

Maximum Supply Voltage:

5.7 V

Minimum Supply Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11.505 mm

Trade Compliance

MC10E116FNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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