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MC100LVEP16MNR4G

Onsemi

MC100LVEP16MNR4G by Onsemi

MC100LVEP16MNR4G by Onsemi is a Line Transceiver IC with differential output. It operates in industrial temperature range (-40 to 85 °C) and has a small outline package style. With max supply voltage of 3.8 V, it offers fast transmission with max delay of 0.32 ns, making it ideal for high-speed communication applications.

Median Price

$5.874

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 224 parts In-Stock

1+ parts

$7.060

100+ parts

$4.592

1k+ parts

$4.590

10k+ parts

-

224

$7.060

$4.592

$4.590

-

Mouser Electronics

USA . 1,030 parts In-Stock

1+ parts

$7.260

100+ parts

$4.720

1k+ parts

$4.240

10k+ parts

-

1,030

$7.260

$4.720

$4.240

-

Rochester

USA . 30,635 parts In-Stock

1+ parts

-

100+ parts

$3.750

1k+ parts

$3.360

10k+ parts

$3.160

30,635

-

$3.750

$3.360

$3.160

Verical

USA . 11,185 parts In-Stock

1+ parts

-

100+ parts

$4.688

1k+ parts

$4.200

10k+ parts

$3.950

11,185

-

$4.688

$4.200

$3.950

Flip Electronics (Authorized)

USA . 510 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

510

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,533 parts In-Stock

1+ parts

$3.962

100+ parts

-

1k+ parts

-

10k+ parts

-

1,533

$3.962

-

-

-

Chip Stock

USA . 76,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

76,000

-

-

-

-

Flip Electronics

USA . 23,510 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23,510

-

-

-

-

Vyrian

USA . 5,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,850

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,504 parts In-Stock

1+ parts

$3.753

100+ parts

-

1k+ parts

-

10k+ parts

-

1,504

$3.753

-

-

-

Corohmni

South Africa . 306 parts In-Stock

1+ parts

$4.170

100+ parts

-

1k+ parts

-

10k+ parts

-

306

$4.170

-

-

-

TANS Electronics

Latvia . 6,718 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,718

-

-

-

-

Problanco Electronics

Mexico . 5,057 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,057

-

-

-

-

Kulean Microsystems

USA . 1,526 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,526

-

-

-

-

SupplyDigital Components

Austria . 936 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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936

-

-

-

-

UHIMA Technologies

Türkiye . 729 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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729

-

-

-

-

Overview

Experience unrivaled performance and reliability with the MC100LVEP16MNR4G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality line drivers & receivers like no other. This cutting-edge product is perfect for a wide range of applications, offering seamless communication and efficient data transmission. With its compact design and advanced features, the MC100LVEP16MNR4G provides exceptional value and benefits to customers, ensuring maximum satisfaction and unparalleled results. Choose Onsemi for superior technology that exceeds expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and compact integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.8 V

Can handle high voltage inputs, providing versatility and compatibility with a wide range of systems.

Package Shape: SQUARE

Square package shape makes it easy to mount and align correctly on a circuit board, ensuring proper functionality.

Maximum Transmit Delay: 0.32 ns

Low transmit delay ensures efficient and fast data transmission, improving overall performance.

No. of Terminals: 8

Sufficient number of terminals for connecting various input and output devices, offering flexibility in system design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Compact package style saves space on the circuit board, while the heat sink/slug design helps dissipate excess heat, ensuring reliability.

Minimum Supply Voltage: 2.375 V

Low minimum supply voltage allows for operation in power-constrained environments, enhancing compatibility.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions, making it suitable for industrial use.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for use in extreme cold environments, adding versatility.

Terminal Finish: NICKEL GOLD PALLADIUM

High-quality terminal finish provides excellent conductivity and resistance to corrosion, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for easy and secure connection, reducing the risk of loose connections or signal interference.

Maximum Seated Height: 1 mm

Low seated height minimizes the overall profile of the product, making it suitable for compact and space-constrained applications.

Width: 2 mm

Compact width allows for easy integration into tight spaces, providing flexibility in system design.

Differential Output: YES

Differential output helps reduce noise and interference, improving signal integrity and overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time allows for quick and efficient soldering during manufacturing, reducing production time.

Peak Reflow Temperature °C: 260

High reflow temperature ensures reliable and secure solder joints, preventing connection failures.

Length: 2 mm

Compact length allows for easy placement on the circuit board, optimizing space utilization.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments, making it a durable choice.

Maximum Receive Delay: 0 ns

Zero receive delay ensures immediate response to incoming signals, enhancing overall system responsiveness.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces the risk of harmful substances in production.

Input Characteristics: DIFFERENTIAL

Differential input enhances immunity to noise and interference, improving signal quality and reliability.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard voltage requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for compact design and precise connection, improving overall system efficiency.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type enables bidirectional communication between multiple devices, enhancing system connectivity.

Technical Specifications

Line Drivers & Receivers MC100LVEP16MNR4G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -2.375 V TO -3.8 V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XDSO-N8

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.32 ns

Width:

2 mm

Trade Compliance

MC100LVEP16MNR4G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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