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MC100LVEP16DTG

Onsemi

MC100LVEP16DTG by Onsemi

MC100LVEP16DTG by Onsemi is a Line Driver with 8 terminals, operating at -40 to 85 °C. It has a max supply voltage of 3.8 V and transmit delay of 0.32 ns. Ideal for industrial applications requiring differential outputs and surface mount compatibility.

Median Price

$6.033

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 22 parts In-Stock

1+ parts

$5.640

100+ parts

-

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22

$5.640

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Mouser Electronics

USA . 961 parts In-Stock

1+ parts

$8.350

100+ parts

$5.940

1k+ parts

$5.190

10k+ parts

-

961

$8.350

$5.940

$5.190

-

DigiKey

USA . 280 parts In-Stock

1+ parts

$9.000

100+ parts

$5.946

1k+ parts

$5.396

10k+ parts

-

280

$9.000

$5.946

$5.396

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Rochester

USA . 17,253 parts In-Stock

1+ parts

-

100+ parts

$4.920

1k+ parts

$4.400

10k+ parts

$4.140

17,253

-

$4.920

$4.400

$4.140

Verical

USA . 15,793 parts In-Stock

1+ parts

-

100+ parts

$6.150

1k+ parts

$5.500

10k+ parts

$5.175

15,793

-

$6.150

$5.500

$5.175

Flip Electronics (Authorized)

USA . 11,400 parts In-Stock

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11,400

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Avnet

USA . 200 parts In-Stock

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200

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Arrow

USA . 20 parts In-Stock

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-

100+ parts

$5.916

1k+ parts

$5.342

10k+ parts

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20

-

$5.916

$5.342

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,500 parts In-Stock

1+ parts

$5.178

100+ parts

-

1k+ parts

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1,500

$5.178

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Flip Electronics

USA . 15,800 parts In-Stock

1+ parts

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15,800

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Vyrian

USA . 6,083 parts In-Stock

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6,083

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NAC Semi

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$11.460

1k+ parts

$10.320

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500

-

$11.460

$10.320

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Resion

USA . 8 parts In-Stock

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8

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Distributors (Availability)

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Corohmni

South Africa . 272 parts In-Stock

1+ parts

$4.868

100+ parts

-

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272

$4.868

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Corphita

USA . 1,500 parts In-Stock

1+ parts

$4.905

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1,500

$4.905

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Component Stockers USA

USA . 19,896 parts In-Stock

1+ parts

$5.540

100+ parts

$5.200

1k+ parts

$4.710

10k+ parts

$4.710

19,896

$5.540

$5.200

$4.710

$4.710

Continental Prestige Electronics

USA . 16,553 parts In-Stock

1+ parts

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$5.200

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16,553

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$5.200

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Problanco Electronics

Mexico . 6,599 parts In-Stock

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6,599

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Kulean Microsystems

USA . 6,493 parts In-Stock

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6,493

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Perfect Parts

USA . 6,184 parts In-Stock

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TANS Electronics

Latvia . 4,771 parts In-Stock

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4,771

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Lixinc

USA . 2,325 parts In-Stock

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SupplyDigital Components

Austria . 1,110 parts In-Stock

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Authorized Procurement Solutions

USA . 868 parts In-Stock

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868

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GreenTree Electronics

Israel . 868 parts In-Stock

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868

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UHIMA Technologies

Türkiye . 763 parts In-Stock

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763

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Eastek

USA . 100 parts In-Stock

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100

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Electronic Sources GmbH

Germany . 53 parts In-Stock

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53

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Speed Components Ltd (Excess)

Israel . 44 parts In-Stock

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44

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Overview

Enhance your signal transmission with the MC100LVEP16DTG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers exceptional quality and reliability in their line drivers & receivers. This versatile product is ideal for a wide range of applications, providing customers with seamless connectivity and improved performance. With features like differential output and a small outline package style, the MC100LVEP16DTG offers unmatched value and benefits to help you achieve optimal results. Elevate your communications with Onsemi's innovative technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the line driver & receiver, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.8 V

Can handle higher voltage levels without risk of damage, providing flexibility in power supply options.

Package Shape: SQUARE

The square shape allows for efficient use of space on the circuit board, making it ideal for compact designs.

Maximum Transmit Delay: 0.32 ns

Provides fast signal transmission, ensuring quick and efficient communication between components.

No. of Terminals: 8

Offers multiple connection points for interfacing with other devices, increasing versatility in system integration.

Terminal Finish: MATTE TIN

Matte tin finish prevents corrosion and ensures reliable electrical connections for optimal performance.

Width: 3 mm

Compact width allows for efficient use of space on the circuit board, ideal for applications with size constraints.

Differential Output: YES

Differential output helps to improve signal quality by reducing noise and interference, resulting in reliable data transmission.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient amount of time during assembly processes, ensuring proper soldering.

Technical Specifications

Line Drivers & Receivers MC100LVEP16DTG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -2.375 V TO -3.8 V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.32 ns

Width:

3 mm

Trade Compliance

MC100LVEP16DTG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-655-5997, 5962016555997

NIIN

016555997

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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