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MC100LVEL16DTG

Onsemi

MC100LVEL16DTG by Onsemi

MC100LVEL16DTG by Onsemi is a Line Receiver IC with ECL technology. It operates at -40 to 85 °C, with +-3.3 V power supplies and 3.8 V max supply voltage. Ideal for applications requiring differential outputs and fast signal transmission in industrial settings.

Median Price

$6.480

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 280 parts In-Stock

1+ parts

$6.480

100+ parts

$4.190

1k+ parts

$3.540

10k+ parts

-

280

$6.480

$4.190

$3.540

-

DigiKey

USA . 135 parts In-Stock

1+ parts

$6.480

100+ parts

$4.193

1k+ parts

$3.782

10k+ parts

$3.679

135

$6.480

$4.193

$3.782

$3.679

Chip1Stop

Japan . 3 parts In-Stock

1+ parts

$7.540

100+ parts

-

1k+ parts

-

10k+ parts

-

3

$7.540

-

-

-

Verical

USA . 4,900 parts In-Stock

1+ parts

-

100+ parts

$3.433

1k+ parts

-

10k+ parts

-

4,900

-

$3.433

-

-

Flip Electronics (Authorized)

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Rochester

USA . 33 parts In-Stock

1+ parts

-

100+ parts

$3.410

1k+ parts

$3.050

10k+ parts

$2.870

33

-

$3.410

$3.050

$2.870

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,003 parts In-Stock

1+ parts

$3.600

100+ parts

-

1k+ parts

-

10k+ parts

-

2,003

$3.600

-

-

-

Vyrian

USA . 5,722 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,722

-

-

-

-

Flip Electronics

USA . 4,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,900

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 189 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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189

-

-

-

-

Inventory MP

USA . 70 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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70

-

-

-

-

Bristol Electronics

USA . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

40

-

-

-

-

Semi Source

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Prism Electronics

USA . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 98 parts In-Stock

1+ parts

$3.220

100+ parts

-

1k+ parts

-

10k+ parts

-

98

$3.220

-

-

-

Corphita

USA . 504 parts In-Stock

1+ parts

$3.411

100+ parts

-

1k+ parts

-

10k+ parts

-

504

$3.411

-

-

-

Corohmni

South Africa . 394 parts In-Stock

1+ parts

$3.790

100+ parts

-

1k+ parts

-

10k+ parts

-

394

$3.790

-

-

-

Microchip USA

USA . 2,599 parts In-Stock

1+ parts

$19.260

100+ parts

$18.990

1k+ parts

$18.850

10k+ parts

$18.710

2,599

$19.260

$18.990

$18.850

$18.710

Lixinc

USA . 15,178 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,178

-

-

-

-

A-Z Elektronik GmbH

Germany . 7,578 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,578

-

-

-

-

TANS Electronics

Latvia . 6,662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,662

-

-

-

-

Problanco Electronics

Mexico . 4,837 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,837

-

-

-

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Kulean Microsystems

USA . 3,970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,970

-

-

-

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GreenTree Electronics

Israel . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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600

-

-

-

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Legend Electronics Inc. (Excess)

USA . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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600

-

-

-

-

Speed Components Ltd (Excess)

Israel . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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600

-

-

-

-

UHIMA Technologies

Türkiye . 499 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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499

-

-

-

-

Perfect Parts

USA . 280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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280

-

-

-

-

SupplyDigital Components

Austria . 106 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

106

-

-

-

-

Overview

The MC100LVEL16DTG by Onsemi is the ultimate solution for your line driver and receiver needs. Manufactured with precision and expertise, this product guarantees top-notch quality and reliability. Whether you're in the telecommunications industry or need high-speed data transmission, this device offers unmatched value and performance. With a wide operating temperature range and differential output capabilities, the MC100LVEL16DTG ensures seamless operation in any environment. Trust Onsemi to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability to withstand various environmental conditions.

Surface Mount: YES

Allows for easy and efficient PCB assembly and saves space on the board.

Maximum Supply Voltage: 3.8 V

Suitable for applications requiring a higher voltage input.

Package Shape: SQUARE

Helps in easy placement and alignment on the circuit board.

Power Supplies (V): +-3.3

Dual power supplies provide stability and balanced operation.

No. of Terminals: 8

Sufficient terminals for connection and signal transmission.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Reduces footprint on the PCB and optimizes space usage.

Minimum Supply Voltage: 3 V

Supports lower voltage requirements for energy-efficient applications.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with high operating temperature environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions without performance issues.

Terminal Finish: MATTE TIN

Provides corrosion resistance and reliable electrical connections.

Maximum Seated Height: 1.1 mm

Low profile design for compact and space-saving installations.

Width: 3 mm

Compact width for fitting into tight spaces on the PCB.

Differential Output: YES

Provides noise immunity and improves signal integrity.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes for reliable assembly.

Temperature Grade: INDUSTRIAL

Designed for industrial applications with demanding temperature requirements.

Maximum Receive Delay: 0.375 ns

Ensures fast signal transmission and response times.

Technology: ECL

Utilizes Emitter-Coupled Logic for high-speed and low-power operation.

Terminal Form: GULL WING

Facilitates easy soldering onto the PCB for secure connections.

Maximum Supply Current: 24 mA

Efficient power consumption for energy-efficient applications.

Input Characteristics: DIFFERENTIAL

Allows for better noise rejection and improved signal quality.

Nominal Supply Voltage: 3.3 V

Standard voltage level for compatibility with most systems.

Nominal Negative Supply Voltage: -3.3 V

Balanced negative supply for stable operation.

Terminal Pitch: 0.65 mm

Optimal terminal spacing for easy PCB layout and assembly.

Moisture Sensitivity Level (MSL): 3

Suitable for environments with moderate moisture exposure.

Interface IC Type: LINE RECEIVER

Specifically designed for signal reception and processing, ensuring accurate data transmission.

Technical Specifications

Line Drivers & Receivers MC100LVEL16DTG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -3.8V SUPPLY IN NECL MODE

Differential Output:

YES

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-3.3 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.375 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

24 mA

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MC100LVEL16DTG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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