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MC100EP16VTDR2G

Onsemi

MC100EP16VTDR2G by Onsemi

MC100EP16VTDR2G by Onsemi is a Line Driver with 8 terminals, ECL technology, and differential output. It operates b/w -40 to 85 °C with supply voltage range of 3-5.5 V. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

$6.312

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,465 parts In-Stock

1+ parts

-

100+ parts

$5.610

1k+ parts

$5.020

10k+ parts

$4.720

12,465

-

$5.610

$5.020

$4.720

Verical

USA . 12,465 parts In-Stock

1+ parts

-

100+ parts

$7.013

1k+ parts

$6.275

10k+ parts

$5.900

12,465

-

$7.013

$6.275

$5.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,544 parts In-Stock

1+ parts

$5.938

100+ parts

-

1k+ parts

-

10k+ parts

-

1,544

$5.938

-

-

-

Vyrian

USA . 5,739 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,739

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,251 parts In-Stock

1+ parts

$5.625

100+ parts

-

1k+ parts

-

10k+ parts

-

2,251

$5.625

-

-

-

Corohmni

South Africa . 482 parts In-Stock

1+ parts

$6.250

100+ parts

-

1k+ parts

-

10k+ parts

-

482

$6.250

-

-

-

Component Stockers USA

USA . 17,169 parts In-Stock

1+ parts

$6.490

100+ parts

$6.100

1k+ parts

$5.520

10k+ parts

$5.520

17,169

$6.490

$6.100

$5.520

$5.520

AZTECH Wire

Italy . 494 parts In-Stock

1+ parts

$17.400

100+ parts

-

1k+ parts

-

10k+ parts

-

494

$17.400

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 12,814 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,814

-

-

-

-

Continental Prestige Electronics

USA . 12,465 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.620

10k+ parts

-

12,465

-

-

$5.620

-

Kulean Microsystems

USA . 6,993 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,993

-

-

-

-

Problanco Electronics

Mexico . 4,929 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,929

-

-

-

-

SupplyDigital Components

Austria . 4,837 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,837

-

-

-

-

TANS Electronics

Latvia . 4,459 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,459

-

-

-

-

Microchip USA

USA . 455 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

455

-

-

-

-

UHIMA Technologies

Türkiye . 371 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

371

-

-

-

-

Overview

Enhance your electronic designs with the MC100EP16VTDR2G by Onsemi. This line driver and receiver offers superior quality and reliability, backed by Onsemi's reputation for excellence in manufacturing. Ideal for a wide range of applications, this product provides fast data transmission with minimal delay, ensuring optimal performance. With its compact design and advanced technology, the MC100EP16VTDR2G delivers exceptional value and efficiency to customers. Upgrade your projects with this innovative solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

This allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing versatility.

Maximum Transmit Delay: 0.35 ns

The low transmit delay ensures fast data transmission, crucial for high-performance systems.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the product to operate in extreme environments, enhancing reliability.

Differential Output: YES

Differential output reduces signal interference and improves noise immunity, leading to more reliable data transmission.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, making the product suitable for demanding applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage is commonly used in electronics, ensuring compatibility with standard power sources.

Technical Specifications

Line Drivers & Receivers MC100EP16VTDR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-4.5 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Qualification:

Not Qualified

Maximum Receive Delay:

.35 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

48 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.35 ns

Width:

3.9 mm

Trade Compliance

MC100EP16VTDR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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