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MC100EP16VSDG

Onsemi

MC100EP16VSDG by Onsemi

MC100EP16VSDG by Onsemi is a Line Driver & Receiver with ECL technology. It operates at 3-5.5 V, -40 to 85 °C, and has 0.28 ns transmit/receive delay. Ideal for industrial applications requiring differential input/output characteristics in a compact SMD package.

Median Price

$4.100

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 101 parts In-Stock

1+ parts

$4.100

100+ parts

$2.640

1k+ parts

$2.180

10k+ parts

$1.830

101

$4.100

$2.640

$2.180

$1.830

Rochester

USA . 58,928 parts In-Stock

1+ parts

-

100+ parts

$3.370

1k+ parts

$3.020

10k+ parts

$2.840

58,928

-

$3.370

$3.020

$2.840

Verical

USA . 15,233 parts In-Stock

1+ parts

-

100+ parts

$4.213

1k+ parts

$3.775

10k+ parts

$3.550

15,233

-

$4.213

$3.775

$3.550

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,471 parts In-Stock

1+ parts

$2.024

100+ parts

-

1k+ parts

-

10k+ parts

-

2,471

$2.024

-

-

-

Vyrian

USA . 8,020 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,020

-

-

-

-

PC Components Company LLC

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Bristol Electronics

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,548 parts In-Stock

1+ parts

$1.917

100+ parts

-

1k+ parts

-

10k+ parts

-

1,548

$1.917

-

-

-

Corohmni

South Africa . 478 parts In-Stock

1+ parts

$2.200

100+ parts

-

1k+ parts

-

10k+ parts

-

478

$2.200

-

-

-

AZTECH Wire

Italy . 164 parts In-Stock

1+ parts

$20.880

100+ parts

-

1k+ parts

-

10k+ parts

-

164

$20.880

-

-

-

Continental Prestige Electronics

USA . 58,928 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

58,928

-

-

-

-

Kepictronics

USA . 27,146 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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27,146

-

-

-

-

TANS Electronics

Latvia . 7,172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,172

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 4,861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,861

-

-

-

-

SupplyDigital Components

Austria . 4,737 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,737

-

-

-

-

Kulean Microsystems

USA . 4,437 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,437

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Problanco Electronics

Mexico . 2,910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,910

-

-

-

-

Microchip USA

USA . 481 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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481

-

-

-

-

UHIMA Technologies

Türkiye . 286 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

286

-

-

-

-

Perfect Parts

USA . 175 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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175

-

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-

-

Overview

Enhance your communication systems with the MC100EP16VSDG by Onsemi. This high-quality line driver and receiver offers exceptional performance and reliability, making it ideal for a wide range of applications. With its advanced technology and industrial-grade design, this product ensures seamless data transmission and maximum efficiency. Upgrade your systems today and experience the value and benefits that Onsemi brings to your business operations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the line driver & receiver, ensuring long-term reliability.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

Can operate efficiently with a wide range of supply voltages, providing flexibility in various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on circuit boards, optimizing space usage.

Maximum Transmit Delay: 0.28 ns

Provides high-speed data transmission, making it suitable for time-sensitive applications.

Power Supplies (V): -4.5

Supports negative power supplies, enabling the device to work in a wider range of circuit configurations.

No. of Terminals: 8

Sufficient number of terminals for connecting to external components and circuitry, ensuring versatile connectivity options.

Maximum Operating Temperature: 85 °C

Can function in high-temperature environments, enhancing the product's reliability in various operating conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, making it suitable for harsh environmental conditions.

Terminal Finish: TIN

Tin terminal finish offers good conductivity and solderability, facilitating easy and reliable connections during installation.

Terminal Position: DUAL

The dual terminal position allows for flexibility in circuit design and routing, enabling customized configurations.

Maximum Seated Height: 1.75 mm

Low seated height enables compact and slim design of the overall system, particularly beneficial in space-constrained applications.

Width: 3.9 mm

Slim width makes it suitable for compact circuit board designs, helping to save space in electronic devices.

Differential Output: YES

Differential output helps in noise rejection and signal integrity, ensuring reliable data transmission in noisy environments.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reflow process within the specified time frame, avoiding damage to the components.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly, ensuring the reliability and structural integrity of the device.

Length: 4.9 mm

Optimal length for accommodating the internal components and ensuring proper functionality without compromising space efficiency.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation in demanding conditions.

Maximum Receive Delay: 0.28 ns

Low receive delay contributes to high-speed data reception, maintaining efficient communication in time-critical applications.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, making the product suitable for demanding applications.

Terminal Form: GULL WING

Gull wing terminals provide mechanical strength and easy inspection during assembly, ensuring reliable solder joints.

Maximum Supply Current: 48 mA

Efficiently operates with low supply current, contributing to power efficiency and reducing energy consumption.

Input Characteristics: DIFFERENTIAL

Differential inputs enhance noise immunity and signal integrity, ensuring reliable data transmission in noisy environments.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and reliable operation in various voltage conditions.

Nominal Negative Supply Voltage: -4.5 V

Provides necessary negative supply voltage for proper signal operation, supporting versatile circuit configurations.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy soldering and reliable connections, ensuring proper integration onto circuit boards.

Interface IC Type: LINE TRANSCEIVER

Specifically designed for line transmission applications, ensuring compatibility and optimized performance in data communication systems.

Technical Specifications

Line Drivers & Receivers MC100EP16VSDG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-4.5 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Qualification:

Not Qualified

Maximum Receive Delay:

.28 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

48 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.28 ns

Width:

3.9 mm

Trade Compliance

MC100EP16VSDG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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