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MC100EP16TMNR4G

Onsemi

MC100EP16TMNR4G by Onsemi

MC100EP16TMNR4G by Onsemi is a Line Transceiver with ECL technology. It operates at 3.3V nominal voltage and -5.2V negative supply voltage, suitable for industrial applications. Features include 0.3ns max transmit/receive delay and 39mA max supply current, in a small outline package with dual terminals.

Median Price

$6.312

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

$5.610

1k+ parts

$5.020

10k+ parts

$4.720

15,000

-

$5.610

$5.020

$4.720

Verical

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

$7.013

1k+ parts

$6.275

10k+ parts

$5.900

15,000

-

$7.013

$6.275

$5.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,873 parts In-Stock

1+ parts

$5.938

100+ parts

-

1k+ parts

-

10k+ parts

-

1,873

$5.938

-

-

-

Vyrian

USA . 4,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,220

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 150 parts In-Stock

1+ parts

$5.620

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$5.620

-

-

-

Corphita

USA . 2,119 parts In-Stock

1+ parts

$5.625

100+ parts

-

1k+ parts

-

10k+ parts

-

2,119

$5.625

-

-

-

AZTECH Wire

Italy . 217 parts In-Stock

1+ parts

$21.430

100+ parts

-

1k+ parts

-

10k+ parts

-

217

$21.430

-

-

-

Continental Prestige Electronics

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.620

10k+ parts

-

15,000

-

-

$5.620

-

Problanco Electronics

Mexico . 6,883 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,883

-

-

-

-

SupplyDigital Components

Austria . 5,637 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,637

-

-

-

-

TANS Electronics

Latvia . 4,150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,150

-

-

-

-

Kulean Microsystems

USA . 2,033 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,033

-

-

-

-

UHIMA Technologies

Türkiye . 349 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

349

-

-

-

-

Microchip USA

USA . 245 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

245

-

-

-

-

Overview

Experience seamless data transmission with the MC100EP16TMNR4G by Onsemi, a cutting-edge line driver and receiver designed for industrial applications. Onsemi's commitment to quality ensures reliable performance in challenging environments, offering customers peace of mind. This compact and high-speed device is ideal for use in communication systems, network equipment, and test and measurement instruments. With its advanced technology and durable construction, the MC100EP16TMNR4G provides exceptional value and unmatched benefits to users looking for superior signal integrity and precision in their systems. Elevate your projects with Onsemi's innovative solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as package body material makes the product lightweight and durable, ideal for electronic applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5 V provides flexibility in power supply options for the product.

Package Shape: RECTANGULAR

The rectangular package shape is standard and easy to handle during assembly and installation.

Maximum Transmit Delay: 0.3 ns

The low maximum transmit delay of 0.3 ns ensures fast and efficient signal transmission.

Power Supplies (V): -5.2

The negative power supply of -5.2 V allows for differential signal processing and high-speed operation.

No. of Terminals: 8

The 8 terminals provide multiple connection points for input and output signals, enhancing flexibility in system integration.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile of the package style save space on PCBs and enable compact designs.

Maximum High Level Input Current: 0.00015 Amp

The low maximum high-level input current ensures minimal power consumption and efficient operation.

Minimum Supply Voltage: 3 V

The minimum supply voltage requirement of 3 V allows for operation in a wide range of power supply settings.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures the product can operate in cold environments without compromising performance.

Terminal Finish: NICKEL GOLD PALLADIUM

The terminal finish of nickel gold palladium provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options and better signal routing in complex system designs.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm saves space on PCBs and enables compact device designs.

Width: 2 mm

The narrow width of 2 mm allows for efficient placement on PCBs and enables high-density circuit layouts.

Differential Output: YES

The differential output capability ensures noise immunity and signal integrity in high-speed data transmission applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C enables reliable soldering and rework processes during assembly.

Length: 2 mm

The compact length of 2 mm allows for space-efficient placement on PCBs and compact device designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand harsh operating conditions and industrial environments.

Maximum Receive Delay: 0.3 ns

The low maximum receive delay of 0.3 ns ensures fast signal reception and processing for efficient data communication.

Technology: ECL

The ECL technology used in the product enables high-speed and low-power operation, ideal for demanding applications.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and compliance with RoHS directives for sustainable manufacturing.

Maximum Supply Current: 39 mA

The maximum supply current of 39 mA ensures efficient power usage and low operating costs for the product.

Input Characteristics: DIFFERENTIAL

The differential input characteristics provide noise immunity and signal integrity for reliable data transmission in noisy environments.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures compatibility with standard power supply configurations for ease of integration.

Nominal Negative Supply Voltage: -5.2 V

The nominal negative supply voltage of -5.2 V allows for differential signal processing and high-speed operation in dual power supply systems.

Terminal Pitch: 0.5 mm

The narrow terminal pitch of 0.5 mm allows for high-density mounting and efficient signal routing in compact PCB designs.

Interface IC Type: LINE TRANSCEIVER

The interface IC type of a line transceiver provides seamless integration with communication systems for reliable data transmission and reception.

Technical Specifications

Line Drivers & Receivers MC100EP16TMNR4G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00015 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-N8

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Receive Delay:

.3 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

39 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.3 ns

Width:

2 mm

Trade Compliance

MC100EP16TMNR4G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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