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MC100EP16FDTR2G

Onsemi

MC100EP16FDTR2G by Onsemi

MC100EP16FDTR2G by Onsemi is a Line Driver & Receiver with ECL technology. It operates at 3-5.5V, has 0.26ns transmit/receive delay, and 40mA supply current. Ideal for industrial applications requiring high-speed differential signal transmission in compact spaces.

Median Price

$5.614

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,675 parts In-Stock

1+ parts

-

100+ parts

$4.990

1k+ parts

$4.460

10k+ parts

$4.200

7,675

-

$4.990

$4.460

$4.200

Verical

USA . 5,175 parts In-Stock

1+ parts

-

100+ parts

$6.237

1k+ parts

$5.575

10k+ parts

-

5,175

-

$6.237

$5.575

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,552 parts In-Stock

1+ parts

$5.282

100+ parts

-

1k+ parts

-

10k+ parts

-

1,552

$5.282

-

-

-

Vyrian

USA . 8,166 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,166

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 379 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

-

10k+ parts

-

379

$5.000

-

-

-

Corphita

USA . 553 parts In-Stock

1+ parts

$5.004

100+ parts

-

1k+ parts

-

10k+ parts

-

553

$5.004

-

-

-

AZTECH Wire

Italy . 779 parts In-Stock

1+ parts

$13.280

100+ parts

-

1k+ parts

-

10k+ parts

-

779

$13.280

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 28,575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28,575

-

-

-

-

Continental Prestige Electronics

USA . 7,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.000

10k+ parts

-

7,675

-

-

$5.000

-

SupplyDigital Components

Austria . 6,203 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,203

-

-

-

-

Problanco Electronics

Mexico . 6,041 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,041

-

-

-

-

Kulean Microsystems

USA . 4,980 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,980

-

-

-

-

Microchip USA

USA . 3,972 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,972

-

-

-

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TANS Electronics

Latvia . 3,841 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,841

-

-

-

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UHIMA Technologies

Türkiye . 748 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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748

-

-

-

-

Overview

Enhance your electronic designs with the MC100EP16FDTR2G by Onsemi. This high-quality line driver and receiver offers superior performance and reliability, backed by Onsemi's reputation for excellence in semiconductor manufacturing. Ideal for applications requiring precise signal transmission, this product delivers unmatched value with its fast transmit and receive delays, differential outputs, and wide temperature range. Trust Onsemi to provide cutting-edge technology that meets your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

Support for a high maximum supply voltage ensures compatibility with a wide range of systems and applications.

Package Shape: RECTANGULAR

Rectangular shape provides versatility in mounting options and fits well within standard PCB layouts.

Maximum Transmit Delay: 0.26 ns

Ultra-low transmit delay ensures fast and efficient signal transmission, crucial for high-speed data communication.

Power Supplies (V): -4.5

Support for negative power supplies allows for flexibility in power configurations, enabling compatibility with various systems.

No. of Terminals: 8

Having 8 terminals provides ample connectivity options for interfacing with other components in a circuit.

Minimum Supply Voltage: 3 V

Support for low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function reliably in cold environments.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability, ensuring easy and reliable connections during assembly.

Width: 3 mm

Compact width allows for space-efficient placement on a PCB, ideal for applications with limited board space.

Differential Output: YES

Differential output helps reduce noise and improve signal integrity, making the product suitable for high-fidelity data transmission.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the product's reliability in demanding operating conditions.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, ideal for applications requiring fast and efficient signal processing.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and reliable connections, ensuring stability in a variety of application environments.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V ensures compatibility with standard power sources and allows for easy integration into existing systems.

Technical Specifications

Line Drivers & Receivers MC100EP16FDTR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-4.5 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Qualification:

Not Qualified

Maximum Receive Delay:

.26 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.26 ns

Width:

3 mm

Trade Compliance

MC100EP16FDTR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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