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MC100EP16FDTG

Onsemi

MC100EP16FDTG by Onsemi

MC100EP16FDTG by Onsemi is a Line Driver & Receiver with ECL technology. It operates at industrial temperature range (-40 to 85 °C) and has a max supply voltage of 5.5 V. With differential output, it is suitable for high-speed communication applications requiring precise signal transmission within 0.26 ns delay.

Median Price

$7.928

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 31 parts In-Stock

1+ parts

$9.620

100+ parts

$6.560

1k+ parts

$5.250

10k+ parts

$5.040

31

$9.620

$6.560

$5.250

$5.040

DigiKey

USA . 20 parts In-Stock

1+ parts

$9.620

100+ parts

-

1k+ parts

-

10k+ parts

-

20

$9.620

-

-

-

Rochester

USA . 44,468 parts In-Stock

1+ parts

-

100+ parts

$4.990

1k+ parts

$4.460

10k+ parts

$4.200

44,468

-

$4.990

$4.460

$4.200

Verical

USA . 13,800 parts In-Stock

1+ parts

-

100+ parts

$6.237

1k+ parts

$5.575

10k+ parts

$5.250

13,800

-

$6.237

$5.575

$5.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 868 parts In-Stock

1+ parts

$5.282

100+ parts

-

1k+ parts

-

10k+ parts

-

868

$5.282

-

-

-

Vyrian

USA . 8,131 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,131

-

-

-

-

Semi Source

USA . 23 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,529 parts In-Stock

1+ parts

$5.004

100+ parts

-

1k+ parts

-

10k+ parts

-

1,529

$5.004

-

-

-

Corohmni

South Africa . 475 parts In-Stock

1+ parts

$5.560

100+ parts

-

1k+ parts

-

10k+ parts

-

475

$5.560

-

-

-

Component Stockers USA

USA . 40,271 parts In-Stock

1+ parts

$5.680

100+ parts

$5.340

1k+ parts

$4.820

10k+ parts

$4.820

40,271

$5.680

$5.340

$4.820

$4.820

Microchip USA

USA . 281 parts In-Stock

1+ parts

$26.660

100+ parts

$26.280

1k+ parts

$26.080

10k+ parts

$25.890

281

$26.660

$26.280

$26.080

$25.890

Continental Prestige Electronics

USA . 44,468 parts In-Stock

1+ parts

-

100+ parts

$5.060

1k+ parts

-

10k+ parts

-

44,468

-

$5.060

-

-

Problanco Electronics

Mexico . 5,003 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,003

-

-

-

-

SupplyDigital Components

Austria . 2,388 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,388

-

-

-

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Kulean Microsystems

USA . 2,107 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,107

-

-

-

-

UHIMA Technologies

Türkiye . 744 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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744

-

-

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TANS Electronics

Latvia . 234 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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234

-

-

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Perfect Parts

USA . 122 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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122

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-

Overview

Enhance your communication systems with the MC100EP16FDTG from Onsemi, a leading manufacturer in the industry of Line Drivers & Receivers. This high-quality product offers fast transmit and receive delays, ensuring efficient data transfer. With its compact design and wide operating temperature range, this line transceiver is perfect for industrial applications where reliability is key. Upgrade your systems today and experience the benefits of this top-notch technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making the product versatile.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board.

Maximum Transmit Delay: 0.26 ns

Low transmit delay ensures fast and efficient data transmission.

Power Supplies (V): -4.5

Supports negative power supply, enhancing compatibility in different systems.

No. of Terminals: 8

Sufficient number of terminals for connecting to other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the circuit board and reduces overall system size.

Minimum Supply Voltage: 3 V

Low minimum supply voltage helps in reducing power consumption.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliable performance in various environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in extreme temperature conditions.

Terminal Finish: TIN

Tin terminal finish provides a reliable electrical connection.

Terminal Position: DUAL

Dual terminal position allows for flexible installation options.

Maximum Seated Height: 1.1 mm

Low seated height minimizes the overall profile of the product.

Width: 3 mm

Compact width dimension for efficient use of space on the circuit board.

Differential Output: YES

Differential output helps in reducing noise and improving signal quality.

Maximum Time At Peak Reflow Temperature (s): 30

Supports fast reflow processes for quick assembly.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance for reliable soldering.

Length: 3 mm

Compact length dimension for efficient use of space on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable performance in harsh industrial environments.

Maximum Receive Delay: 0.26 ns

Low receive delay ensures fast reception of data signals.

Technology: ECL

ECL technology for high-speed and low-power operation.

Terminal Form: GULL WING

Gull wing terminal form for reliable soldering and electrical connections.

Maximum Supply Current: 40 mA

Low supply current for reduced power consumption.

Input Characteristics: DIFFERENTIAL

Differential input for noise rejection and improved signal integrity.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage for compatibility with common power sources.

Nominal Negative Supply Voltage: -4.5 V

Standard nominal negative supply voltage for compatibility with common power sources.

Terminal Pitch: 0.65 mm

Fine terminal pitch for compact design and efficient board layout.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates good resistance to moisture during storage and handling.

Interface IC Type: LINE TRANSCEIVER

Specifically designed as a line transceiver for efficient communication between systems or devices.

Technical Specifications

Line Drivers & Receivers MC100EP16FDTG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-4.5 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Qualification:

Not Qualified

Maximum Receive Delay:

.26 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.26 ns

Width:

3 mm

Trade Compliance

MC100EP16FDTG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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