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MC100EP16FDG

Onsemi

MC100EP16FDG by Onsemi

MC100EP16FDG by Onsemi is a Line Driver & Receiver with ECL technology. It operates at 3-5.5V, has 0.26ns transmit/receive delay, and supports differential output/input. Ideal for industrial applications requiring high-speed data transmission in compact designs.

Median Price

$4.208

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 37,511 parts In-Stock

1+ parts

-

100+ parts

$3.740

1k+ parts

$3.350

10k+ parts

$3.150

37,511

-

$3.740

$3.350

$3.150

Verical

USA . 13,728 parts In-Stock

1+ parts

-

100+ parts

$4.675

1k+ parts

$4.188

10k+ parts

$3.938

13,728

-

$4.675

$4.188

$3.938

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,490 parts In-Stock

1+ parts

$3.962

100+ parts

-

1k+ parts

-

10k+ parts

-

2,490

$3.962

-

-

-

Vyrian

USA . 5,765 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,765

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,991 parts In-Stock

1+ parts

$3.753

100+ parts

-

1k+ parts

-

10k+ parts

-

1,991

$3.753

-

-

-

Corohmni

South Africa . 211 parts In-Stock

1+ parts

$4.170

100+ parts

-

1k+ parts

-

10k+ parts

-

211

$4.170

-

-

-

AZTECH Wire

Italy . 840 parts In-Stock

1+ parts

$8.140

100+ parts

-

1k+ parts

-

10k+ parts

-

840

$8.140

-

-

-

Continental Prestige Electronics

USA . 37,737 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

37,737

-

-

-

-

Problanco Electronics

Mexico . 5,069 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,069

-

-

-

-

Kulean Microsystems

USA . 4,662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,662

-

-

-

-

Microchip USA

USA . 3,899 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,899

-

-

-

-

SupplyDigital Components

Austria . 3,549 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,549

-

-

-

-

TANS Electronics

Latvia . 2,651 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,651

-

-

-

-

UHIMA Technologies

Türkiye . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

160

-

-

-

-

Perfect Parts

USA . 147 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

147

-

-

-

-

Overview

Enhance your electronic designs with the MC100EP16FDG line driver & receiver by Onsemi. Crafted with precision and reliability in mind, this product from a trusted manufacturer offers unparalleled performance across a wide range of applications. With its cutting-edge technology and durable construction, this device ensures seamless data transmission and reception, making it an essential component for your projects. Experience the value and benefits that this high-quality line driver & receiver brings to your work, providing you with the competitive edge you need to succeed in today's fast-paced market. Trust Onsemi to deliver excellence in every product, starting with the MC100EP16FDG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various environments.

Surface Mount: YES

Allows for easy and convenient installation on printed circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltage, making it versatile for different applications.

Package Shape: RECTANGULAR

The rectangular shape helps in easy integration and placement within electronic devices.

Maximum Transmit Delay: 0.26 ns

Ensures fast and efficient data transmission, critical for high-speed communication systems.

Power Supplies (V): -4.5

Supports a negative power supply voltage, which can be useful in certain configurations and designs.

No. of Terminals: 8

Provides multiple connection points for interfacing with other components, increasing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

Compact design helps in conserving space on the PCB and enables dense packaging of components.

Minimum Supply Voltage: 3 V

Works reliably with a low supply voltage, suitable for energy-efficient applications.

Maximum Operating Temperature: 85 °C

Can operate effectively in high-temperature environments, ensuring reliability under challenging conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold temperatures, making it suitable for a wide range of operating conditions.

Terminal Finish: TIN

Tin finish provides corrosion resistance and good solderability, ensuring a reliable electrical connection.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options and facilitates easy connections.

Maximum Seated Height: 1.75 mm

Low profile design enables the product to be used in space-constrained applications or stacked configurations.

Width: 3.9 mm

Narrow width saves PCB real estate and allows for compact system designs.

Differential Output: YES

Differential output helps in reducing noise and improving signal integrity, crucial for high-speed data transmission.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during reflow process, maintaining the integrity of connections.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures without any significant impact on performance.

Length: 4.9 mm

Compact length allows for efficient use of board space and facilitates dense packing of components.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with extended temperature ranges and robust performance requirements.

Maximum Receive Delay: 0.26 ns

Low receive delay ensures quick response times, critical for maintaining data integrity in communication systems.

Technology: ECL

ECL technology offers high-speed performance and excellent noise immunity, ideal for demanding applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and inspection during assembly, ensuring reliable connections.

Maximum Supply Current: 40 mA

Low supply current ensures power efficiency and helps in reducing overall system power consumption.

Input Characteristics: DIFFERENTIAL

Differential input improves noise rejection and signal integrity, crucial for reliable data transmission.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Nominal Negative Supply Voltage: -4.5 V

Reliable negative supply voltage support allows for proper biasing and operation in various circuit configurations.

Terminal Pitch: 1.27 mm

Standard terminal pitch facilitates easy connection and compatibility with common PCB layouts.

Interface IC Type: LINE TRANSCEIVER

Specifically designed for interfacing with communication lines, ensuring efficient data exchange and signal conversion.

Technical Specifications

Line Drivers & Receivers MC100EP16FDG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-4.5 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Qualification:

Not Qualified

Maximum Receive Delay:

.26 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.26 ns

Width:

3.9 mm

Trade Compliance

MC100EP16FDG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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