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LV59018M-TLM-H

Onsemi

LV59018M-TLM-H by Onsemi

LV59018M-TLM-H by Onsemi is a Power Management IC with 3V supply voltage, 8 terminals, and max operating temp of 85 °C. Ideal for applications requiring small outline package style, such as power supplies in electronic devices.

Median Price

$0.436

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

$0.436

1k+ parts

$0.362

10k+ parts

$0.323

15,000

-

$0.436

$0.362

$0.323

DigiKey

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.370

10k+ parts

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15,000

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-

$0.370

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Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.452

10k+ parts

$0.403

5,000

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-

$0.452

$0.403

Distributors (In-Stock)

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Digiode

USA . 378 parts In-Stock

1+ parts

$0.339

100+ parts

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378

$0.339

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Vyrian

USA . 1,510 parts In-Stock

1+ parts

$0.357

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1,510

$0.357

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DigiKey Marketplace

USA . 15,000 parts In-Stock

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$0.370

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15,000

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$0.370

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Chip Stock

USA . 7,500 parts In-Stock

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7,500

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Distributors (Availability)

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Corphita

USA . 1,858 parts In-Stock

1+ parts

$0.321

100+ parts

-

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1,858

$0.321

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Corohmni

South Africa . 310 parts In-Stock

1+ parts

$0.357

100+ parts

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310

$0.357

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Component Stockers USA

USA . 3,838 parts In-Stock

1+ parts

$0.360

100+ parts

$0.340

1k+ parts

$0.310

10k+ parts

$0.310

3,838

$0.360

$0.340

$0.310

$0.310

QUARKTWIN TECHNOLOGY LTD

USA . 27,955 parts In-Stock

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Continental Prestige Electronics

USA . 15,000 parts In-Stock

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$0.315

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$0.315

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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TANS Electronics

Latvia . 7,644 parts In-Stock

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Kulean Microsystems

USA . 6,285 parts In-Stock

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6,285

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Microchip USA

USA . 4,112 parts In-Stock

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Problanco Electronics

Mexico . 3,188 parts In-Stock

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3,188

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SupplyDigital Components

Austria . 641 parts In-Stock

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641

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UHIMA Technologies

Türkiye . 121 parts In-Stock

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121

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Overview

Discover the pinnacle of power management with the LV59018M-TLM-H by Onsemi. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product boasts a compact package body material and surface-mount design, making it versatile and efficient. With a nominal supply voltage of 3V and dual terminals for ease of use, customers can trust in the value and benefits that this innovative technology brings to their projects. Elevate your power management solutions with Onsemi's LV59018M-TLM-H.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and making it convenient for manufacturing.

Nominal Supply Voltage (Vsup): 3 V

With a 3V supply voltage, this product is compatible with a wide range of devices and systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in various environmental conditions.

Technology: BICMOS

BICMOS technology offers a combination of high-speed performance and low power consumption, making the product efficient.

Technical Specifications

Power Management ICs LV59018M-TLM-H attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.16 mA

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LV59018M-TLM-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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