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LV59033M-TLM-H

Onsemi

LV59033M-TLM-H by Onsemi

LV59033M-TLM-H by Onsemi is a Power Management IC with 5V nominal voltage and 8 terminals. It operates b/w -30 to 85 °C, has a max supply current of 0.16mA, and uses BICMOS technology. Ideal for applications requiring small outline package style and surface mount compatibility.

Median Price

$0.403

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

$0.436

1k+ parts

$0.362

10k+ parts

$0.323

10,000

-

$0.436

$0.362

$0.323

DigiKey

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.370

10k+ parts

-

10,000

-

-

$0.370

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,978 parts In-Stock

1+ parts

$0.339

100+ parts

-

1k+ parts

-

10k+ parts

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1,978

$0.339

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-

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Vyrian

USA . 1,427 parts In-Stock

1+ parts

$0.357

100+ parts

-

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-

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1,427

$0.357

-

-

-

DigiKey Marketplace

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

$0.370

1k+ parts

-

10k+ parts

-

10,000

-

$0.370

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 863 parts In-Stock

1+ parts

$0.321

100+ parts

-

1k+ parts

-

10k+ parts

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863

$0.321

-

-

-

Corohmni

South Africa . 239 parts In-Stock

1+ parts

$0.357

100+ parts

-

1k+ parts

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239

$0.357

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 29,966 parts In-Stock

1+ parts

-

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29,966

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-

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TANS Electronics

Latvia . 7,716 parts In-Stock

1+ parts

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7,716

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-

-

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SupplyDigital Components

Austria . 4,970 parts In-Stock

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4,970

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Kulean Microsystems

USA . 1,699 parts In-Stock

1+ parts

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1,699

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-

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Problanco Electronics

Mexico . 1,490 parts In-Stock

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1,490

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Microchip USA

USA . 352 parts In-Stock

1+ parts

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352

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UHIMA Technologies

Türkiye . 119 parts In-Stock

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119

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Overview

Unlock the power of efficient and reliable power management with the LV59033M-TLM-H by Onsemi. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and performance. Ideal for a wide range of applications, this product provides seamless integration and superior functionality. Trust in Onsemi's reputation for excellence and innovation to bring value and benefits to your projects. Experience the advantages of cutting-edge technology and dependable solutions with the LV59033M-TLM-H.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are known for their durability and resistance to heat and chemicals, making this power management IC reliable and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort during manufacturing processes.

Nominal Supply Voltage (Vsup): 5 V

Operating at a commonly used voltage level of 5V makes this power management IC compatible with a wide range of applications and systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this power management IC can function reliably even in demanding environmental conditions.

Technology: BICMOS

Using BiCMOS technology offers a good balance between low power consumption and high-speed performance, making this IC suitable for a variety of power management applications.

Technical Specifications

Power Management ICs LV59033M-TLM-H attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.16 mA

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LV59033M-TLM-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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