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LV5857MX-TLM-H

Onsemi

LV5857MX-TLM-H by Onsemi

LV5857MX-TLM-H by Onsemi is a 3A current-mode switching regulator with BICMOS technology. It operates b/w -20 °C to 80°C, suitable for commercial extended temperature applications. This rectangular package with 8 terminals and Gull Wing form factor is ideal for surface mount designs.

Median Price

$1.260

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.120

1k+ parts

$0.930

10k+ parts

$0.829

1,000

-

$1.120

$0.930

$0.829

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.400

10k+ parts

-

1,000

-

-

$1.400

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 938 parts In-Stock

1+ parts

$0.875

100+ parts

-

1k+ parts

-

10k+ parts

-

938

$0.875

-

-

-

Vyrian

USA . 12,367 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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12,367

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 327 parts In-Stock

1+ parts

$0.829

100+ parts

-

1k+ parts

-

10k+ parts

-

327

$0.829

-

-

-

Corohmni

South Africa . 199 parts In-Stock

1+ parts

$0.921

100+ parts

-

1k+ parts

-

10k+ parts

-

199

$0.921

-

-

-

Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$1.411

100+ parts

$1.284

1k+ parts

$1.157

10k+ parts

-

40

$1.411

$1.284

$1.157

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

TANS Electronics

Latvia . 3,779 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,779

-

-

-

-

Kulean Microsystems

USA . 2,060 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,060

-

-

-

-

SupplyDigital Components

Austria . 1,788 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,788

-

-

-

-

UHIMA Technologies

Türkiye . 390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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390

-

-

-

-

Microchip USA

USA . 155 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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155

-

-

-

-

Problanco Electronics

Mexico . 21 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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21

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-

Overview

Experience the power of innovation with the LV5857MX-TLM-H by Onsemi, a top-of-the-line switching regulator and controller designed to deliver unparalleled performance and reliability. Manufactured by industry leader Onsemi, this product boasts cutting-edge technology and superior quality, making it the ideal choice for a wide range of applications. With features such as a small outline package, current-mode control, and a maximum output current of 3A, the LV5857MX-TLM-H offers unmatched value and benefits to customers seeking efficient and dependable solutions. Upgrade your projects today with this exceptional product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving time and effort during assembly.

No. of Terminals: 8

Having multiple terminals provides flexibility in connecting the product to other components, enabling versatile use.

Maximum Output Current: 3 A

With a high maximum output current, this product is capable of delivering sufficient power for demanding applications.

Technology: BICMOS

The BICMOS technology ensures efficient performance and power management, enhancing the overall effectiveness of the product.

Technical Specifications

Switching Regulators & Controllers LV5857MX-TLM-H attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

CURRENT-MODE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

8

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LV5857MX-TLM-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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