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LV5803NM

Onsemi

LV5803NM by Onsemi

LV5803NM by Onsemi is a current-mode switching regulator with max. operating temp of 80 °C and min. operating temp of -20°C. Featuring BICMOS technology, it has a max. switching frequency of 395 kHz, ideal for commercial extended temperature grade applications in small outline packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 506 parts In-Stock

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Digiode

USA . 118 parts In-Stock

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TANS Electronics

Latvia . 8,215 parts In-Stock

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SupplyDigital Components

Austria . 6,846 parts In-Stock

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Kulean Microsystems

USA . 6,166 parts In-Stock

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Corphita

USA . 1,566 parts In-Stock

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UHIMA Technologies

Türkiye . 512 parts In-Stock

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512

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Corohmni

South Africa . 177 parts In-Stock

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Problanco Electronics

Mexico . 114 parts In-Stock

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Overview

Looking for a reliable and efficient solution for your switching regulator needs? Look no further than the LV5803NM by Onsemi. As a trusted manufacturer in the industry, Onsemi is known for delivering high-quality products that exceed expectations. The LV5803NM offers a compact design with a wide temperature range, making it perfect for various applications. With its current-mode control mode and high switching frequency, this product provides excellent performance and reliability. Upgrade to the LV5803NM today and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material helps in reducing the overall weight of the product, making it easier to handle and install.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto a circuit board.

Package Shape: RECTANGULAR

Rectangular shape makes the product more space-efficient and allows for better utilization of board space.

No. of Terminals: 8

More terminals provide additional connectivity options and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in conserving board space and makes the product suitable for compact designs.

Maximum Operating Temperature: 80 °C

High maximum operating temperature ensures stable performance even in demanding conditions.

Control Mode: CURRENT-MODE

Current-mode control provides better transient response and improved stability in regulating the output.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature range allows for operation in a wide range of environments.

Terminal Position: DUAL

Dual terminal position offers redundancy and better connectivity options for varied applications.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures reliable operation in various commercial applications.

Maximum Switching Frequency: 395 kHz

High switching frequency allows for fast response times and efficient power conversion.

Technology: BICMOS

BICMOS technology offers a combination of high-speed performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable solder connections for better durability.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high-density mounting and compact layout on circuit boards.

Technical Specifications

Switching Regulators & Controllers LV5803NM attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

CURRENT-MODE

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

395 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LV5803NM Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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