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LV58063MX-TLM-H

Onsemi

LV58063MX-TLM-H by Onsemi

LV58063MX-TLM-H by Onsemi is a current-mode switching regulator with max output current of 3A and max switching frequency of 444kHz. Ideal for commercial extended temp applications, it features BICMOS technology in a small outline package.

Median Price

$0.779

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

$0.779

1k+ parts

$0.647

10k+ parts

$0.577

7,000

-

$0.779

$0.647

$0.577

DigiKey

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.660

10k+ parts

-

7,000

-

-

$0.660

-

Verical

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.809

10k+ parts

$0.721

7,000

-

-

$0.809

$0.721

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,081 parts In-Stock

1+ parts

$0.607

100+ parts

-

1k+ parts

-

10k+ parts

-

1,081

$0.607

-

-

-

Vyrian

USA . 1,309 parts In-Stock

1+ parts

$0.639

100+ parts

-

1k+ parts

-

10k+ parts

-

1,309

$0.639

-

-

-

DigiKey Marketplace

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

$0.660

1k+ parts

-

10k+ parts

-

7,000

-

$0.660

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,051 parts In-Stock

1+ parts

$0.575

100+ parts

-

1k+ parts

-

10k+ parts

-

1,051

$0.575

-

-

-

Corohmni

South Africa . 162 parts In-Stock

1+ parts

$0.639

100+ parts

-

1k+ parts

-

10k+ parts

-

162

$0.639

-

-

-

Component Stockers USA

USA . 12,644 parts In-Stock

1+ parts

$0.660

100+ parts

$0.620

1k+ parts

$0.560

10k+ parts

-

12,644

$0.660

$0.620

$0.560

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$6.488

100+ parts

$5.904

1k+ parts

$5.320

10k+ parts

-

3,000

$6.488

$5.904

$5.320

-

Kepictronics

USA . 25,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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25,000

-

-

-

-

Authorized Procurement Solutions

USA . 25,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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25,000

-

-

-

-

Metaverse IC Inc.

Canada . 16,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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16,000

-

-

-

-

Assy Fe

Spain . 16,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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16,000

-

-

-

-

Problanco Electronics

Mexico . 5,363 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,363

-

-

-

-

SupplyDigital Components

Austria . 5,129 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,129

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 3,679 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,679

-

-

-

-

Kulean Microsystems

USA . 3,670 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,670

-

-

-

-

TANS Electronics

Latvia . 1,531 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,531

-

-

-

-

Microchip USA

USA . 471 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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471

-

-

-

-

UHIMA Technologies

Türkiye . 17 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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17

-

-

-

-

Overview

Elevate your power management solutions with the LV58063MX-TLM-H by Onsemi. Crafted with precision and expertise, this switching regulator offers top-notch performance and reliability. Ideal for a wide range of applications, this product stands out for its efficient control mode, high output current, and advanced BICMOS technology. With a compact design and durable construction, this regulator provides customers with unmatched value and benefits. Say goodbye to power fluctuations and hello to seamless operations with the LV58063MX-TLM-H.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the product, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular package shape provides versatility for placement within electronic systems and makes it easier to design and integrate into circuits.

No. of Terminals: 8

Having 8 terminals allows for more flexibility in connecting the device to other components, enabling a wider range of circuit configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, making it ideal for compact electronic devices where size is a constraint.

Maximum Operating Temperature: 80 °C

High maximum operating temperature tolerance ensures the product can function reliably even in demanding environmental conditions.

Control Mode: CURRENT-MODE

Current-mode control offers precise regulation of output current, improving efficiency and performance of the switching regulator.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature ensures the product can operate in a wide range of temperature conditions, enhancing its versatility.

Terminal Finish: Tin/Bismuth (Sn/Bi)

Tin/Bismuth terminal finish provides good solderability and corrosion resistance, ensuring reliable electrical connections over extended periods.

Maximum Switching Frequency: 444 kHz

High maximum switching frequency allows for fast and efficient power conversion, reducing losses and improving overall performance.

Maximum Output Current: 3 A

Capable of delivering up to 3A output current, making it suitable for a wide range of power requirements in various applications.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption for improved efficiency.

Terminal Form: GULL WING

Gull wing terminal form provides good mechanical strength and ease of soldering, enhancing the reliability and durability of the product.

Terminal Pitch: 1.27 mm

1.27mm terminal pitch allows for easy connections on the circuit board, simplifying assembly processes and ensuring accurate alignment.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates the product can withstand moderate levels of moisture exposure during storage and assembly, ensuring long-term reliability.

Technical Specifications

Switching Regulators & Controllers LV58063MX-TLM-H attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

CURRENT-MODE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

8

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

444 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LV58063MX-TLM-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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