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LV5808MXZ

Onsemi

LV5808MXZ by Onsemi

LV5808MXZ by Onsemi is a current-mode switching regulator with max output current of 1A and max switching frequency of 444kHz. It operates b/w -20 °C to 80°C, suitable for commercial extended temperature applications. This BICMOS technology device comes in an 8-terminal small outline package ideal for surface mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,767 parts In-Stock

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Vyrian

USA . 245 parts In-Stock

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245

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Problanco Electronics

Mexico . 7,888 parts In-Stock

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SupplyDigital Components

Austria . 5,348 parts In-Stock

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Corphita

USA . 764 parts In-Stock

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UHIMA Technologies

Türkiye . 611 parts In-Stock

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TANS Electronics

Latvia . 331 parts In-Stock

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Kulean Microsystems

USA . 181 parts In-Stock

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Corohmni

South Africa . 52 parts In-Stock

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Overview

Discover the innovative LV5808MXZ by Onsemi, a cutting-edge switching regulator and controller that combines top-notch quality with unmatched performance. With a focus on precision engineering and reliability, Onsemi has solidified its reputation as a leader in the industry. Ideal for a wide range of applications, this product promises seamless operation and efficiency. Experience the value and benefits of the LV5808MXZ, offering customers the advantage of superior technology and unparalleled functionality. Elevate your projects with this exceptional solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the regulator, ensuring durability and reliability.

Surface Mount: YES

Being surface mountable makes it easier to integrate into compact designs and saves space on the PCB.

No. of Terminals: 8

Having 8 terminals allows for more flexibility in connecting various external components and peripherals.

Maximum Output Current: 1 A

The ability to handle a maximum output current of 1A makes this regulator suitable for powering a variety of electronic devices and circuits.

Maximum Switching Frequency: 444 kHz

High switching frequency allows for efficient and fast regulation of voltage, leading to better performance and reduced ripple.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, providing high performance with low power consumption.

Technical Specifications

Switching Regulators & Controllers LV5808MXZ attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

CURRENT-MODE

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

444 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LV5808MXZ Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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