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LV5803M-TE-L-E

Onsemi

LV5803M-TE-L-E by Onsemi

LV5803M-TE-L-E by Onsemi is a current-mode switching regulator with max output current of 2A and max switching frequency of 395kHz. Ideal for commercial extended temperature applications, it features BICMOS technology in a small outline package suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 80,000 parts In-Stock

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Vyrian

USA . 13,193 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

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Digiode

USA . 875 parts In-Stock

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875

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AZTECH Wire

Italy . 710 parts In-Stock

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$15.290

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710

$15.290

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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TANS Electronics

Latvia . 6,225 parts In-Stock

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Kulean Microsystems

USA . 4,401 parts In-Stock

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Kepictronics

USA . 4,000 parts In-Stock

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Problanco Electronics

Mexico . 3,950 parts In-Stock

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SupplyDigital Components

Austria . 2,495 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

USA . 826 parts In-Stock

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Microchip USA

USA . 472 parts In-Stock

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Corohmni

South Africa . 459 parts In-Stock

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UHIMA Technologies

Türkiye . 241 parts In-Stock

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Overview

Discover the power and efficiency of the LV5803M-TE-L-E by Onsemi, a cutting-edge switching regulator that sets the standard for quality and reliability in its category. With Onsemi's reputation for excellence, this product offers unmatched performance and versatility for a wide range of applications. From its high output current to its advanced control mode, customers can expect seamless operation and optimal results. Experience the value and benefits of this top-of-the-line product today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internals of the switching regulator, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability makes installation and assembly of the regulator easier and more convenient.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of board space and simplifies placement on the circuit board.

No. of Terminals: 8

8 terminals provide sufficient connectivity options for various applications and configurations.

Maximum Output Current: 2 A

High maximum output current of 2 A enables the regulator to power demanding electrical loads effectively.

Maximum Switching Frequency: 395 kHz

High switching frequency of 395 kHz results in smoother output voltage and efficient power conversion.

Technology: BICMOS

BICMOS technology offers a balance between high speed and low power consumption, making the regulator efficient and versatile.

Technical Specifications

Switching Regulators & Controllers LV5803M-TE-L-E attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

CURRENT-MODE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

395 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LV5803M-TE-L-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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