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LV5808MX

Onsemi

LV5808MX by Onsemi

LV5808MX by Onsemi is a current-mode switching regulator with max output current of 1A and max switching frequency of 444 kHz. Ideal for commercial applications, it operates b/w -20 °C to 80°C in a small outline package style suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 527 parts In-Stock

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Digiode

USA . 282 parts In-Stock

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TANS Electronics

Latvia . 4,130 parts In-Stock

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Kulean Microsystems

USA . 2,350 parts In-Stock

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Corphita

USA . 1,909 parts In-Stock

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SupplyDigital Components

Austria . 1,636 parts In-Stock

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Problanco Electronics

Mexico . 1,424 parts In-Stock

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Corohmni

South Africa . 397 parts In-Stock

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UHIMA Technologies

Türkiye . 275 parts In-Stock

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Overview

Onsemi's LV5808MX offers top-notch quality and performance in the switching regulators & controllers category. This versatile product is perfect for a wide range of applications, delivering reliable power management solutions. With Onsemi's reputation for excellence in semiconductor manufacturing, customers can trust that they are getting a high-quality product that will meet their needs. Experience the value and benefits of the LV5808MX, from its compact design to its efficient control mode, providing customers with the essential features they need for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the product, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and improving overall design efficiency.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the regulator to other components in the circuit, enabling versatile usage.

Maximum Output Current: 1 A

The maximum output current of 1 A ensures that the regulator can deliver sufficient power to support various loads, making it suitable for a range of applications.

Maximum Switching Frequency: 444 kHz

A high switching frequency of 444 kHz enables efficient power conversion, reducing ripple and improving overall performance of the regulator.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high-speed operation and low power consumption for optimal performance.

Technical Specifications

Switching Regulators & Controllers LV5808MX attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

CURRENT-MODE

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

444 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LV5808MX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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