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LV58082MX

Onsemi

LV58082MX by Onsemi

LV58082MX by Onsemi is a current-mode switching regulator with max. operating temp of 80 °C and freq. of 444 kHz. Ideal for commercial applications, it features BICMOS tech, dual terminals, and small outline package style for efficient power control in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,434 parts In-Stock

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1,434

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Vyrian

USA . 366 parts In-Stock

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366

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Kulean Microsystems

USA . 6,435 parts In-Stock

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6,435

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Problanco Electronics

Mexico . 4,366 parts In-Stock

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4,366

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TANS Electronics

Latvia . 2,080 parts In-Stock

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2,080

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UHIMA Technologies

Türkiye . 903 parts In-Stock

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903

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SupplyDigital Components

Austria . 476 parts In-Stock

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Corohmni

South Africa . 352 parts In-Stock

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352

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Corphita

USA . 199 parts In-Stock

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Overview

Experience the next level of power management with the LV58082MX by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers cutting-edge solutions for switching regulators & controllers. Ideal for a wide range of applications, this product offers unmatched value, benefits, and advantages to customers. Say goodbye to inefficiency and hello to optimized performance with the LV58082MX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying the overall design.

Package Shape: RECTANGULAR

Provides a standard and familiar form factor for easy installation and compatibility with existing systems.

No. of Terminals: 8

Provides sufficient input and output connections for versatile applications and flexible configurations.

Maximum Operating Temperature: 80 °C

Ensures reliable performance even in high-temperature environments, increasing the product's versatility.

Control Mode: CURRENT-MODE

Offers precise control over the output current, leading to stable operation and efficient power management.

Technology: BICMOS

Combines the benefits of both bipolar and CMOS technologies, resulting in high performance, low power consumption, and compact size.

Maximum Switching Frequency: 444 kHz

Allows for fast response times and efficient power conversion, making the product ideal for applications requiring quick adjustments.

Technical Specifications

Switching Regulators & Controllers LV58082MX attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

CURRENT-MODE

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

444 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LV58082MX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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