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LC74784

Onsemi

LC74784 by Onsemi

LC74784 by Onsemi is a display controller with 24 terminals, operating at temperatures from -30 °C to 70°C. It has a supply voltage of 5V and uses CMOS technology. This graphics processor IC is housed in a rectangular plastic/epoxy package, making it suitable for various display applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,070 parts In-Stock

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1,070

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Vyrian

USA . 794 parts In-Stock

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794

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Distributors (Availability)

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Kulean Microsystems

USA . 6,522 parts In-Stock

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6,522

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SupplyDigital Components

Austria . 6,513 parts In-Stock

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6,513

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TANS Electronics

Latvia . 5,374 parts In-Stock

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5,374

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Problanco Electronics

Mexico . 4,579 parts In-Stock

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4,579

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Kepictronics

USA . 968 parts In-Stock

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968

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Corohmni

South Africa . 499 parts In-Stock

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499

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UHIMA Technologies

Türkiye . 479 parts In-Stock

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479

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Corphita

USA . 62 parts In-Stock

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62

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Overview

Enhance your display experience with the LC74784 by Onsemi, a top-quality display controller designed to elevate your visual creations. Onsemi's dedication to excellence shines through in this innovative product, offering seamless integration, reliable performance, and unmatched versatility. Whether you're designing digital signage, interactive displays, or gaming devices, the LC74784 delivers exceptional value, empowering you to bring your ideas to life with ease. Upgrade your designs and captivate your audience with the LC74784 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, making the display controller easy to handle and resistant to damage.

Package Shape: RECTANGULAR

The rectangular shape allows for easier integration into electronic devices and enables efficient use of space within the device.

Power Supplies (V): 5

Operating at 5 volts allows for compatibility with a wide range of devices and power sources, making it versatile and easy to integrate.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options for various components, ensuring flexibility in system design and functionality.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch package style enables a compact design, saving space within the device and making installation easier.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures reliable performance in a variety of environmental conditions.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30 °C allows for use in cold environments without compromising performance or reliability.

Terminal Position: DUAL

The dual terminal position provides redundancy and improves signal stability, ensuring consistent and reliable operation of the display controller.

Peripheral IC Type: GRAPHICS PROCESSOR

Featuring a graphics processor as the peripheral IC type enables high-quality visuals and smooth display performance, making it an excellent choice for graphics-intensive applications.

Technology: CMOS

Utilizing CMOS technology results in low power consumption, high speed operation, and compatibility with a wide range of devices, making the display controller energy-efficient and versatile.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for secure and reliable connections, reducing the risk of loose connections or signal interference.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 volts ensures compatibility with standard power sources and simplifies integration into various electronic systems.

Terminal Pitch: 1.78 mm

The 1.78 mm terminal pitch provides sufficient spacing for easy soldering and connection, facilitating installation and maintenance of the display controller.

Technical Specifications

Display Controllers LC74784 attributes and parameters. Explore more Display Controllers devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Display Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

LC74784 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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