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LC7020BT

Onsemi

LC7020BT by Onsemi

The Onsemi LC7020BT is a 64-terminal IC with +-5V power supplies, operating from -30 to 70 °C. It features a flatpack package style and consumes 0.3mA supply current. Ideal for consumer electronics applications requiring a compact, surface-mountable solution.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,339 parts In-Stock

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Digiode

USA . 1,543 parts In-Stock

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1,543

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 6,935 parts In-Stock

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6,935

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TANS Electronics

Latvia . 4,147 parts In-Stock

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4,147

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Kulean Microsystems

USA . 4,050 parts In-Stock

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4,050

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Corphita

USA . 2,091 parts In-Stock

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2,091

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Problanco Electronics

Mexico . 1,615 parts In-Stock

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1,615

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UHIMA Technologies

Türkiye . 552 parts In-Stock

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552

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Corohmni

South Africa . 187 parts In-Stock

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Overview

Unleash the power of innovation with the LC7020BT by Onsemi. This cutting-edge consumer IC boasts superior quality and reliability, backed by the renowned manufacturer Onsemi. Perfect for a wide range of applications, this product offers exceptional value and benefits to customers seeking top-notch performance. Experience seamless functionality and efficiency like never before with the LC7020BT - the ultimate choice for your electronic needs.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the internal components, making the product suitable for long-term use.

Surface Mount - YES

Surface mount design allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Package Shape - SQUARE

Square package shape enables efficient use of space on the PCB, making it easier to integrate this component into various electronic devices.

Power Supplies (V) - +-5

Support for dual power supplies of +/-5V allows for flexibility in voltage requirements, making this product versatile for different applications.

No. of Terminals - 64

Having 64 terminals provides a high level of connectivity options, allowing for the connection of various external devices and components.

Package Style (Meter) - FLATPACK

Flatpack package style offers a slim profile, saving space on the PCB and making it suitable for compact electronic designs.

Maximum Operating Temperature - 70 °C

With a maximum operating temperature of 70 °C, this product can withstand high temperature environments without compromising performance.

Minimum Operating Temperature - -30 °C

A minimum operating temperature of -30 °C ensures reliable operation even in cold conditions, making it suitable for a wide range of environments.

Terminal Position - QUAD

Quad terminal position allows for easy and secure connection to the PCB, minimizing the risk of loose connections and signal interference.

Terminal Form - FLAT

Flat terminal form provides a solid and stable connection, ensuring reliable signal transmission and reducing the risk of signal loss.

Maximum Supply Current - 0.3 mA

A maximum supply current of 0.3 mA indicates low power consumption, making this product energy-efficient and suitable for battery-operated devices.

Terminal Pitch - 0.8 mm

A terminal pitch of 0.8 mm allows for finer spacing between terminals, enabling high-density PCB designs and enhancing overall performance.

Technical Specifications

Other Function Consumer ICs LC7020BT attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-F64

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFF

Package Equivalence Code:

QFL64,.55SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

+-5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

.3 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

LC7020BT General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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