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LC70310KBG-TLM-H

Onsemi

LC70310KBG-TLM-H by Onsemi

LC70310KBG-TLM-H by Onsemi is a 64-terminal consumer IC with power supplies of 1.2V and 3/3.3V, suitable for various applications. It features a package style of grid array, very thin profile, and fine pitch, making it ideal for consumer circuit designs. With a temperature range from -30 to 70 °C and CMOS technology, this IC offers reliable performance in diverse environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,717 parts In-Stock

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Vyrian

USA . 336 parts In-Stock

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336

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SupplyDigital Components

Austria . 5,332 parts In-Stock

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5,332

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Kulean Microsystems

USA . 4,479 parts In-Stock

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4,479

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Problanco Electronics

Mexico . 4,287 parts In-Stock

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TANS Electronics

Latvia . 3,776 parts In-Stock

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Corphita

USA . 2,392 parts In-Stock

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Corohmni

South Africa . 459 parts In-Stock

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459

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UHIMA Technologies

Türkiye . 142 parts In-Stock

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Overview

Experience seamless performance and reliability with Onsemi's LC70310KBG-TLM-H, a high-quality consumer IC that delivers unparalleled efficiency in various applications. This cutting-edge product offers exceptional value, benefits, and advantages to customers seeking top-notch electronic components. Trust in Onsemi's reputation for excellence and innovation as you explore the endless possibilities of this versatile and advanced technology. Elevate your projects with the LC70310KBG-TLM-H and witness the difference quality makes in every circuit.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving space in electronic devices.

Package Shape: SQUARE

Square package shape is more uniform and easier to mount on a PCB compared to irregular shapes.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, making it suitable for a wide range of electronic devices.

Power Supplies (V): 1.2,3/3.3

Supports multiple power supply voltages, making it versatile for different power requirements.

No. of Terminals: 64

Provides a sufficient number of connections for interfacing with other components in the system.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array and thin profile design allow for high density integration on the PCB, enabling compact device designs.

Maximum Operating Temperature: 70 °C

Can operate in relatively high-temperature environments without performance degradation.

Minimum Operating Temperature: -30 °C

Wide operating temperature range ensures reliable operation in various environmental conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure mounting on the PCB.

Maximum Seated Height: 1 mm

Low profile design helps in reducing the overall height of the electronic device.

Width: 5 mm

Compact width allows for space-efficient PCB layout and overall device size.

Minimum Supply Voltage (Vsup): 1.08 V

Supports low supply voltage operation, ideal for energy-efficient applications.

Length: 5 mm

Compact length contributes to the overall small form factor of the device.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable performance.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and facilitates soldering during assembly.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on the PCB, saving space and improving signal integrity.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates resistance to moderate moisture exposure during storage or operation.

Maximum Supply Voltage (Vsup): 1.32 V

Supports a maximum supply voltage to ensure safe operation within specified limits.

Technical Specifications

Other Function Consumer ICs LC70310KBG-TLM-H attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 2.7 TO 3.6

General IC Type:

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Power Supplies (V):

1.2,3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.32 V

Minimum Supply Voltage (Vsup):

1.08 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Trade Compliance

LC70310KBG-TLM-H General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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