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LC7020AT

Onsemi

LC7020AT by Onsemi

The Onsemi LC7020AT is a 64-terminal IC with +-5V power supplies, operating from -30 to 70 °C. Its GULL WING terminals and FLATPACK style make it suitable for consumer electronics applications requiring low supply current of 0.3mA. The surface-mountable PLASTIC/EPOXY package ensures durability in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 645 parts In-Stock

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645

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Digiode

USA . 447 parts In-Stock

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447

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Corel Iberica Componentes, S.L.

Spain . 2 parts In-Stock

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Problanco Electronics

Mexico . 6,864 parts In-Stock

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SupplyDigital Components

Austria . 6,527 parts In-Stock

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6,527

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Corphita

USA . 2,310 parts In-Stock

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Kulean Microsystems

USA . 1,752 parts In-Stock

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UHIMA Technologies

Türkiye . 669 parts In-Stock

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669

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Corohmni

South Africa . 357 parts In-Stock

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TANS Electronics

Latvia . 257 parts In-Stock

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Assy Fe

Spain . 2 parts In-Stock

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Overview

Unleash the power of innovation with the LC7020AT by Onsemi. This cutting-edge consumer IC boasts unparalleled quality and reliability, setting a new standard in the industry. From smart home devices to automotive electronics, this versatile product delivers superior performance across a wide range of applications. With Onsemi's trusted reputation for excellence, customers can trust that they are investing in a product that offers unmatched value, benefits, and advantages. Upgrade your technology with the LC7020AT and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mounting allows for easy integration into circuit boards, saving space and simplifying assembly processes.

Package Shape: SQUARE

Square packages are often standardized and easy to handle, making the product compatible with various PCB layouts.

Power Supplies (V): +-5

The dual power supply of +-5V allows for versatile compatibility with different voltage systems, increasing the product's flexibility.

No. of Terminals: 64

Having a high number of terminals enables the product to support complex circuit connections and functionalities.

Package Style (Meter): FLATPACK

The flatpack style saves space on the PCB, allowing for more components to be integrated, increasing the product's functionality.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand challenging environmental conditions, ensuring reliability in various applications.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature enables the product to perform in cold environments without any issues, making it versatile and durable.

Terminal Position: QUAD

Quad terminal positioning enables efficient connection and reliable performance, ensuring stable operation of the product.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and easy soldering, enhancing the product's reliability and ease of installation.

Maximum Supply Current: 0.3 mA

With a low maximum supply current, the product consumes minimal power, making it energy-efficient and cost-effective.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting on the PCB, enabling compact design and efficient use of space.

Technical Specifications

Other Function Consumer ICs LC7020AT attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.8SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

+-5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

.3 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

LC7020AT General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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