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LC706210CA

Onsemi

LC706210CA by Onsemi

LC706210CA by Onsemi is a rectangular, surface-mount consumer IC with 8 terminals. Operating temperature ranges from -40 to 85 °C. It operates on a supply voltage b/w 1.64V to 3.6V, making it suitable for industrial applications requiring MOS technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,280 parts In-Stock

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Vyrian

USA . 1,728 parts In-Stock

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SupplyDigital Components

Austria . 7,516 parts In-Stock

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TANS Electronics

Latvia . 6,238 parts In-Stock

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Problanco Electronics

Mexico . 5,860 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Kulean Microsystems

USA . 2,969 parts In-Stock

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Corphita

USA . 1,420 parts In-Stock

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UHIMA Technologies

Türkiye . 611 parts In-Stock

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Corohmni

South Africa . 219 parts In-Stock

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Overview

Discover a world of endless possibilities with the LC706210CA by Onsemi. Crafted with precision and expertise, this consumer IC offers unparalleled quality and reliability. Perfect for a wide range of applications in the electronics industry, this versatile chip provides exceptional value and benefits to customers. Trust in Onsemi's reputation for excellence and innovation as you explore the countless advantages that the LC706210CA has to offer. Elevate your projects to new heights with this cutting-edge technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on PCBs, saving space and facilitating mass production.

Package Shape: RECTANGULAR

Rectangular shape offers a traditional and versatile design for compatibility with a wide range of applications.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronics applications, ensuring reliability and performance in everyday devices.

No. of Terminals: 8

Provides sufficient connectivity options for various circuit configurations.

Package Style (Meter): UNCASED CHIP

The unencased chip design offers a compact form factor and enables direct integration into systems for efficient PCB layout.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where higher temperatures can be encountered, ensuring reliable operation.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in cold environments without compromising performance.

Terminal Position: UPPER

Upper terminal position facilitates easier PCB design and routing for connections.

Width: 1.08 mm

Small width dimension saves space on PCB and enables compact device designs.

Minimum Supply Voltage (Vsup): 1.64 V

Low minimum supply voltage enables operation in power-constrained applications while maintaining functionality.

Length: 1.48 mm

Compact length dimension contributes to space-saving on PCBs and in end products.

Temperature Grade: INDUSTRIAL

Designed to meet industrial-grade standards for reliability and performance in demanding environments.

Technology: MOS

MOS technology offers low power consumption and high speed performance, suitable for various consumer electronic devices.

Terminal Form: NO LEAD

No lead terminals reduce the risk of solder joint failures and improve overall reliability.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage allows for compatibility with a wide range of power sources without risk of overloading.

Technical Specifications

Other Function Consumer ICs LC706210CA attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-XUUC-N8

Length:

1.48 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.64 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.08 mm

Trade Compliance

LC706210CA General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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