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LC7020AK

Onsemi

LC7020AK by Onsemi

The Onsemi LC7020AK is a 64-terminal IC with +-5V power supplies, operating from -30 to 70 °C. Its GULL WING terminals and FLATPACK style make it suitable for consumer electronics applications requiring low supply current of 0.3 mA. The surface-mountable PLASTIC/EPOXY package ensures durability in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,787 parts In-Stock

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1,787

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Digiode

USA . 479 parts In-Stock

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479

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Huijzer Components

Netherlands . 30 parts In-Stock

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30

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Distributors (Availability)

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SupplyDigital Components

Austria . 8,335 parts In-Stock

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8,335

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Kulean Microsystems

USA . 6,872 parts In-Stock

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6,872

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TANS Electronics

Latvia . 5,072 parts In-Stock

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5,072

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Problanco Electronics

Mexico . 2,881 parts In-Stock

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2,881

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UHIMA Technologies

Türkiye . 850 parts In-Stock

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850

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Corphita

USA . 295 parts In-Stock

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295

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Corohmni

South Africa . 236 parts In-Stock

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236

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Assy Fe

Spain . 3 parts In-Stock

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Overview

Discover the exceptional quality and reliability of the LC7020AK by Onsemi, a leading manufacturer in the industry. This versatile product falls under the category of Other Function Consumer ICs, offering a wide range of applications for various electronic devices. With its advanced technology and durable construction using plastic/epoxy material, this surface mount device ensures superior performance and longevity. Customers can enjoy the value and benefits of this product, including stable power supplies, easy installation with 64 terminals, and a wide operating temperature range. Upgrade your electronics with the LC7020AK and experience unmatched efficiency and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, which is ideal for consumer electronics applications.

Surface Mount: Yes

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in manufacturing processes.

Package Shape: SQUARE

The square package shape ensures space-efficient PCB layout design and easy integration into various electronic devices.

Power Supplies (V): +-5

The wide range of power supply voltage tolerance of +-5V provides flexibility in various power input options, making it compatible with different power sources.

No. of Terminals: 64

Having 64 terminals allows for multiple input/output connections, enabling the product to handle complex functions and data processing tasks efficiently.

Package Style (Meter): FLATPACK

The flatpack package style offers better heat dissipation, compact size, and improved thermal performance, making it suitable for high-density electronic applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures reliable performance in various environmental conditions, making it suitable for wide-ranging applications.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30 °C ensures the product can withstand cold temperatures, making it suitable for both indoor and outdoor applications.

Terminal Position: QUAD

The quad terminal position allows for easy connectivity and installation on the PCB, facilitating efficient assembly and maintenance processes.

Terminal Form: GULL WING

The gull wing terminal form offers reliable solder connection and mechanical strength, ensuring secure electrical connections and robust performance.

Maximum Supply Current: 0.3 mA

The low maximum supply current of 0.3 mA helps in reducing power consumption, making the product energy-efficient and suitable for battery-operated devices.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm allows for high-density PCB layouts and miniaturization of electronic devices, enabling compact and portable designs.

Technical Specifications

Other Function Consumer ICs LC7020AK attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.8SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

+-5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

.3 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

LC7020AK General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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