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LC06511F03MXTAG

Onsemi

LC06511F03MXTAG by Onsemi

LC06511F03MXTAG by Onsemi is a Power Management IC with 6 terminals, operating temperature range of -40 to 85 °C. It has a supply voltage of 3.8 V and max current of 0.006 mA. Ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,573 parts In-Stock

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Digiode

USA . 2,427 parts In-Stock

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AZTECH Wire

Italy . 511 parts In-Stock

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$16.110

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Component Stockers USA

USA . 663 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 6,789 parts In-Stock

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Kulean Microsystems

USA . 5,080 parts In-Stock

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Problanco Electronics

Mexico . 1,249 parts In-Stock

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TANS Electronics

Latvia . 1,161 parts In-Stock

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Corphita

USA . 949 parts In-Stock

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UHIMA Technologies

Türkiye . 489 parts In-Stock

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Corohmni

South Africa . 231 parts In-Stock

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Microchip USA

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Overview

Enhance your power management solutions with the LC06511F03MXTAG by Onsemi. Crafted with precision and quality, this Power Management IC offers unparalleled reliability and performance. Designed to meet industrial standards, this IC is perfect for a wide range of applications. With its small outline, heat sink profile, and dual terminal position, this product provides superior functionality while maintaining an extremely thin profile. Experience the value and benefits that Onsemi brings to the table with this innovative solution. Elevate your projects and streamline your operations with the LC06511F03MXTAG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body enhances durability and resistance to environmental factors, making this product a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during production processes.

Package Shape: SQUARE

The square package shape offers efficient use of space on the circuit board, making it suitable for compact electronic devices.

Nominal Supply Voltage (Vsup): 3.8 V

The 3.8 V nominal supply voltage provides stable power delivery, ensuring consistent performance of the power management functions.

No. of Terminals: 6

Having 6 terminals allows for the connection of multiple input and output components, enabling versatile power management capabilities.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, EXTREMELY THIN PROFILE

The small outline, heat sink/slug, and extremely thin profile package style optimizes heat dissipation and space utilization, making it suitable for compact electronic designs with efficient thermal management.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliability and stability in various operating conditions, making it suitable for industrial applications with demanding thermal requirements.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows for operation in extreme cold environments, increasing the product's versatility for use in a wide range of applications.

Terminal Position: DUAL

The dual terminal position facilitates easy and secure connections, enhancing the overall reliability and stability of the power management circuit.

Maximum Seated Height: 0.4 mm

The low maximum seated height of 0.4 mm helps minimize the overall height profile of the component, making it suitable for slim and compact electronic devices.

Width (mm): 1.4 mm

The narrow width of 1.4 mm contributes to space-saving design considerations, enabling the integration of the power management IC into compact electronic devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC provides essential functionalities for stable and efficient power distribution, making it a valuable component for power management applications.

Length: 1.4 mm

The short length of 1.4 mm complements the narrow width and low height profile, further contributing to a space-efficient design for electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh operating environments, making this power management IC suitable for industrial applications with stringent temperature requirements.

Maximum Supply Current (Isup): 0.006 mA

The low maximum supply current of 0.006 mA indicates energy-efficient operation, helping reduce power consumption and heat generation in the power management system.

Technology: CMOS

Utilizing CMOS technology, this power management IC offers low power consumption, high noise immunity, and reliable operation, making it a cost-effective and efficient choice for various electronic applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and improves reliability by eliminating potential solder joint failures, ensuring secure and robust connections for long-term performance.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for compact placement of terminals on the IC, enabling higher density integration onto circuit boards and efficient routing of signal connections.

Adjustable Threshold: YES

The ability to adjust the threshold level provides flexibility in customizing the power management IC for specific application requirements, enhancing its versatility and adaptability in various electronic systems.

Technical Specifications

Power Management ICs LC06511F03MXTAG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-N6

Length:

1.4 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.06,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, EXTREMELY THIN PROFILE

Maximum Seated Height:

.4 mm

Maximum Supply Current (Isup):

.006 mA

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

1.4 mm

Trade Compliance

LC06511F03MXTAG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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