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LC06511D02MXTAG

Onsemi

LC06511D02MXTAG by Onsemi

LC06511D02MXTAG by Onsemi is a Power Management IC with 6 terminals, operating at -40 to 85 °C. It has a supply voltage of 3.8V and max current of 0.006mA. Ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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DigiKey

USA . 16,000 parts In-Stock

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USA . 16,000 parts In-Stock

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Flip Electronics

USA . 16,000 parts In-Stock

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Digiode

USA . 1,607 parts In-Stock

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Vyrian

USA . 702 parts In-Stock

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702

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Problanco Electronics

Mexico . 5,406 parts In-Stock

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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SupplyDigital Components

Austria . 3,512 parts In-Stock

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Corphita

USA . 1,333 parts In-Stock

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TANS Electronics

Latvia . 905 parts In-Stock

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UHIMA Technologies

Türkiye . 445 parts In-Stock

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Corohmni

South Africa . 285 parts In-Stock

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Kulean Microsystems

USA . 206 parts In-Stock

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Microchip USA

USA . 159 parts In-Stock

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Overview

Enhance your power management solutions with the LC06511D02MXTAG by Onsemi. Crafted with precision using high-quality materials, this Power Management IC offers unparalleled reliability and performance. Ideal for a wide range of applications, this product boasts a compact design and adjustable threshold, ensuring seamless integration into your systems. Trust in Onsemi's expertise and innovation to deliver superior value and efficiency to your projects. Upgrade your power management capabilities today with the LC06511D02MXTAG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards.

Nominal Supply Voltage (Vsup): 3.8 V

The nominal supply voltage of 3.8 V is suitable for a wide range of applications.

No. of Terminals: 6

Having 6 terminals allows for connectivity to multiple components in the circuit.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in challenging conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization and flexibility in operation.

Technical Specifications

Power Management ICs LC06511D02MXTAG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-N6

Length:

1.4 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.06,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, EXTREMELY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.4 mm

Maximum Supply Current (Isup):

.006 mA

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.4 mm

Trade Compliance

LC06511D02MXTAG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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