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LC06511D01MXTAG

Onsemi

LC06511D01MXTAG by Onsemi

LC06511D01MXTAG by Onsemi is a Power Management IC with 6 terminals, 3.8V supply voltage, and CMOS technology. It has a small outline package style and is suitable for power supply support circuits. Operating temperature ranges from -20 to 60 °C, making it ideal for various applications requiring precise power management in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,240 parts In-Stock

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Digiode

USA . 84 parts In-Stock

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AZTECH Wire

Italy . 39 parts In-Stock

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$13.640

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39

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Component Stockers USA

USA . 283 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 7,286 parts In-Stock

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Problanco Electronics

Mexico . 5,133 parts In-Stock

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SupplyDigital Components

Austria . 4,686 parts In-Stock

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Kulean Microsystems

USA . 974 parts In-Stock

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Corphita

USA . 846 parts In-Stock

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UHIMA Technologies

Türkiye . 279 parts In-Stock

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Corohmni

South Africa . 257 parts In-Stock

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Microchip USA

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Overview

Discover the LC06511D01MXTAG by Onsemi, a top-quality Power Management IC designed to optimize performance in various applications. Manufactured by Onsemi, known for their cutting-edge technology and innovation, this small outline, heat sink design offers a very thin profile for easy installation and efficient power supply support. With adjustable threshold and low supply current, this IC provides value by maximizing energy efficiency and reliability. Upgrade your electronic devices with the LC06511D01MXTAG and experience superior power management like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the components inside the package, ensuring a longer lifespan for the power management IC.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, making it convenient for manufacturers to incorporate this power management IC into their products.

Nominal Supply Voltage (Vsup): 3.8 V

A stable and efficient nominal supply voltage of 3.8V ensures consistent power delivery to connected devices, preventing any voltage fluctuations that could potentially damage them.

Maximum Operating Temperature: 60 °C

With a maximum operating temperature of 60 °C, this power management IC can withstand high temperatures, making it suitable for various industrial and commercial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this power management IC energy-efficient and reliable in maintaining a stable power supply.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization of the voltage levels at which certain actions are triggered, providing flexibility and adaptability in different usage scenarios.

Technical Specifications

Power Management ICs LC06511D01MXTAG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-N6

Length:

1.4 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.06,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.4 mm

Maximum Supply Current (Isup):

.006 mA

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.4 mm

Trade Compliance

LC06511D01MXTAG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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