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LC06111TMTTTG

Onsemi

LC06111TMTTTG by Onsemi

LC06111TMTTTG by Onsemi is a Power Management IC with 6 terminals, operating voltage range of 2.6V to 4.3V, and temperature range of -40 °C to 85°C. It is designed for industrial applications requiring small outline, heat sink package style in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 859 parts In-Stock

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Digiode

USA . 759 parts In-Stock

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759

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Problanco Electronics

Mexico . 7,423 parts In-Stock

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Kulean Microsystems

USA . 6,604 parts In-Stock

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TANS Electronics

Latvia . 2,632 parts In-Stock

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UHIMA Technologies

Türkiye . 960 parts In-Stock

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SupplyDigital Components

Austria . 954 parts In-Stock

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Corohmni

South Africa . 379 parts In-Stock

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Corphita

USA . 304 parts In-Stock

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Overview

Experience the next level of power management with the LC06111TMTTTG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Management ICs that are designed to optimize performance and efficiency. This small outline, heat sink package offers a wide range of applications and is perfect for industrial use. With a nominal supply voltage of 3.7V and a temperature grade of industrial, this product ensures reliability and durability. Say goodbye to power supply issues and hello to seamless operations with the LC06111TMTTTG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good thermal properties and durability, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost.

Nominal Supply Voltage (Vsup): 3.7 V

Optimal supply voltage for efficient power management and operation of the device.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance in harsh industrial environments.

Width (mm): 2.6 mm

Compact width size enables space-saving design and integration into tight layout constraints.

Minimum Supply Voltage (Vsup): 2.6 V

Low minimum supply voltage allows for operation in low-power applications, offering flexibility in power requirements.

Technical Specifications

Power Management ICs LC06111TMTTTG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e6

Length:

3.8 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

2.6 V

Nominal Supply Voltage (Vsup):

3.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.6 mm

Trade Compliance

LC06111TMTTTG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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