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LC05111C13MTTTG

Onsemi

LC05111C13MTTTG by Onsemi

LC05111C13MTTTG by Onsemi is a Power Management IC with a supply voltage range of 2.6V to 4.3V, suitable for industrial applications. It features a small outline package style with very thin profile and dual terminal position, making it ideal for power supply support circuits. With an operating temperature range from -40°C to 85°C and surface mount capability, this IC offers reliable performance in various environments.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 616 parts In-Stock

1+ parts

$0.157

100+ parts

$0.148

1k+ parts

$0.143

10k+ parts

-

616

$0.157

$0.148

$0.143

-

Rochester

USA . 133,869 parts In-Stock

1+ parts

-

100+ parts

$0.982

1k+ parts

$0.815

10k+ parts

$0.727

133,869

-

$0.982

$0.815

$0.727

DigiKey

USA . 133,869 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.230

10k+ parts

-

133,869

-

-

$1.230

-

Verical

USA . 129,869 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.019

10k+ parts

$0.908

129,869

-

-

$1.019

$0.908

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 622 parts In-Stock

1+ parts

$0.765

100+ parts

-

1k+ parts

-

10k+ parts

-

622

$0.765

-

-

-

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$0.944

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$0.944

-

-

-

DigiKey Marketplace

USA . 145,191 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

145,191

-

-

-

-

Vyrian

USA . 112,575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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112,575

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,357 parts In-Stock

1+ parts

$0.495

100+ parts

-

1k+ parts

-

10k+ parts

-

2,357

$0.495

-

-

-

Ampacity Inc.

Singapore . 112,611 parts In-Stock

1+ parts

$0.680

100+ parts

-

1k+ parts

-

10k+ parts

-

112,611

$0.680

-

-

-

Corphita

USA . 1,441 parts In-Stock

1+ parts

$0.724

100+ parts

-

1k+ parts

-

10k+ parts

-

1,441

$0.724

-

-

-

Corohmni

South Africa . 479 parts In-Stock

1+ parts

$0.805

100+ parts

-

1k+ parts

-

10k+ parts

-

479

$0.805

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$0.925

100+ parts

-

1k+ parts

$0.888

10k+ parts

-

100

$0.925

-

$0.888

-

Argo Parts USA

USA . 637 parts In-Stock

1+ parts

$0.944

100+ parts

-

1k+ parts

-

10k+ parts

-

637

$0.944

-

-

-

Aztec Data Supply Inc.

USA . 2,611 parts In-Stock

1+ parts

$19.320

100+ parts

-

1k+ parts

-

10k+ parts

-

2,611

$19.320

-

-

-

SupplyDigital Components

Austria . 7,089 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,089

-

-

-

-

TANS Electronics

Latvia . 2,704 parts In-Stock

1+ parts

-

100+ parts

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2,704

-

-

-

-

Problanco Electronics

Mexico . 2,298 parts In-Stock

1+ parts

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2,298

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-

-

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Microchip USA

USA . 2,125 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,125

-

-

-

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Kulean Microsystems

USA . 1,794 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,794

-

-

-

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UHIMA Technologies

Türkiye . 378 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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378

-

-

-

-

Overview

Enhance your power management solutions with the LC05111C13MTTTG by Onsemi. With a reputation for quality and innovation, Onsemi delivers reliable Power Management ICs that meet the demands of today's technology-driven world. This small outline, heat sink profile package offers unparalleled performance in a range of applications. From power supply support circuits to industrial-grade environments, this product provides customers with the value, benefits, and advantages they need to stay ahead in the competitive market. Trust Onsemi for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it a reliable choice for power management.

Surface Mount: YES

Allows for easy and convenient integration onto circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The shape of the package allows for efficient placement on PCBs, optimizing space usage.

Nominal Supply Voltage (Vsup): 3.7 V

The optimal supply voltage ensures stable and efficient power management for connected devices.

No. of Terminals: 6

Sufficient number of terminals for connecting to other components, making it versatile for various applications.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers thermal management and compact design, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures reliability in harsh environments and under heavy load conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in cold environments without compromising performance.

Terminal Finish: TIN BISMUTH

Provides corrosion resistance and ensures good electrical contact, promoting long-term reliability.

Terminal Position: DUAL

Allows for flexible PCB layout and ease of connection, enhancing design options for the application.

Maximum Seated Height: 0.8 mm

Low profile design saves space and allows for compact device designs.

Width (mm): 2.6 mm

Slim width enables the IC to fit in tight spaces, making it suitable for compact devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically to support power supply functions, ensuring efficient and stable power delivery.

Minimum Supply Voltage (Vsup): 2.6 V

Supports a wide range of supply voltages, making it suitable for various power management applications.

Maximum Time At Peak Reflow Temperature (s): 30

Able to withstand peak reflow temperatures for a sufficient duration during assembly processes.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance ensures proper soldering during manufacturing, enhancing product quality.

Length: 3.8 mm

Compact length allows for easy integration and placement in tight spaces.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

Maximum Supply Current (Isup): 0.006 mA

Low supply current consumption for efficient power management and reduced energy consumption.

Technology: CMOS

CMOS technology offers low power consumption and high reliability, making it an ideal choice for power management ICs.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly applications and compliance with regulations.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for precise connections and compatibility with modern PCB design practices.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level ensures proper handling and storage to maintain product reliability.

Maximum Supply Voltage (Vsup): 4.3 V

Supports a wide range of supply voltages, accommodating various power input sources for flexibility in design.

Technical Specifications

Power Management ICs LC05111C13MTTTG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e6

Length:

3.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.16,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current (Isup):

.006 mA

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

2.6 V

Nominal Supply Voltage (Vsup):

3.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.6 mm

Trade Compliance

LC05111C13MTTTG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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