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LC05111C25MTTTG

Onsemi

LC05111C25MTTTG by Onsemi

LC05111C25MTTTG by Onsemi is a Power Management IC with a nominal voltage of 3.7V, suitable for industrial applications. It features a small outline package style, very thin profile, and dual terminal position. With a max operating temperature of 85°C and surface mount capability, it offers efficient power supply support in compact designs.

Median Price

$0.856

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 2,674 parts In-Stock

1+ parts

$1.410

100+ parts

$0.872

1k+ parts

$0.645

10k+ parts

-

2,674

$1.410

$0.872

$0.645

-

DigiKey

USA . 3,745 parts In-Stock

1+ parts

$1.420

100+ parts

$0.833

1k+ parts

$0.727

10k+ parts

-

3,745

$1.420

$0.833

$0.727

-

Mouser Electronics

USA . 3,951 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.621

3,951

-

-

-

$0.621

Farnell

UK . 3,725 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.501

10k+ parts

$0.485

3,725

-

-

$0.501

$0.485

Element14

Singapore . 3,725 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.864

10k+ parts

$0.862

3,725

-

-

$0.864

$0.862

Rochester

USA . 1,474 parts In-Stock

1+ parts

-

100+ parts

$0.847

1k+ parts

$0.703

10k+ parts

$0.627

1,474

-

$0.847

$0.703

$0.627

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,813 parts In-Stock

1+ parts

$0.659

100+ parts

-

1k+ parts

-

10k+ parts

-

1,813

$0.659

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.748

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$0.748

-

-

-

Vyrian

USA . 3,348 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,348

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,129 parts In-Stock

1+ parts

$0.334

100+ parts

-

1k+ parts

-

10k+ parts

-

3,129

$0.334

-

-

-

Continental Prestige Electronics

USA . 3,809 parts In-Stock

1+ parts

$0.415

100+ parts

-

1k+ parts

-

10k+ parts

-

3,809

$0.415

-

-

-

Corohmni

South Africa . 299 parts In-Stock

1+ parts

$0.621

100+ parts

-

1k+ parts

-

10k+ parts

-

299

$0.621

-

-

-

Corphita

USA . 328 parts In-Stock

1+ parts

$0.625

100+ parts

-

1k+ parts

-

10k+ parts

-

328

$0.625

-

-

-

Argo Parts USA

USA . 485 parts In-Stock

1+ parts

$0.748

100+ parts

-

1k+ parts

-

10k+ parts

-

485

$0.748

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.748

100+ parts

-

1k+ parts

$0.711

10k+ parts

$0.696

50

$0.748

-

$0.711

$0.696

Advanced Electronics

New Zealand . 27 parts In-Stock

1+ parts

$1.651

100+ parts

$1.502

1k+ parts

$1.354

10k+ parts

-

27

$1.651

$1.502

$1.354

-

Aztec Data Supply Inc.

USA . 4,171 parts In-Stock

1+ parts

$2.394

100+ parts

-

1k+ parts

-

10k+ parts

-

4,171

$2.394

-

-

-

Authorized Procurement Solutions

USA . 90,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90,000

-

-

-

-

SupplyDigital Components

Austria . 6,582 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,582

-

-

-

-

Kulean Microsystems

USA . 4,784 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,784

-

-

-

-

Problanco Electronics

Mexico . 3,973 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,973

-

-

-

-

TANS Electronics

Latvia . 2,554 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,554

-

-

-

-

UHIMA Technologies

Türkiye . 647 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

647

-

-

-

-

Microchip USA

USA . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

160

-

-

-

-

Overview

Discover the LC05111C25MTTTG by Onsemi - a high-quality Power Management IC that offers unparalleled performance and reliability. Manufactured by Onsemi, a renowned leader in the industry, this compact IC is ideal for a wide range of applications. With a nominal supply voltage of 3.7V and dual terminals, this IC provides efficient power supply support without compromising on quality. Its small outline and very thin profile make it easy to integrate into various projects. Experience the value and benefits of superior performance with the LC05111C25MTTTG - a game-changer in power management technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this Power Management IC lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

With surface mount capability, this IC can be easily integrated onto PCBs, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of PCB real estate, enabling compact design solutions.

Nominal Supply Voltage (Vsup): 3.7 V

The 3.7V nominal supply voltage provides compatibility with a wide range of electronic systems, making this IC versatile and adaptable.

No. of Terminals: 6

The 6 terminals on this IC offer flexible connectivity options, allowing for various input and output configurations.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combines a small outline, heat sink/slug, and very thin profile design, enhancing thermal management and space efficiency in systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can reliably operate in high-temperature environments, ensuring stable performance.

Minimum Operating Temperature: -40 °C

The -40°C minimum operating temperature range allows for use in cold conditions without compromising functionality, increasing the IC's versatility.

Terminal Finish: TIN BISMUTH

The tin bismuth terminal finish provides excellent solderability and long-term reliability, ensuring secure connections in electronic assemblies.

Terminal Position: DUAL

The dual terminal position offers redundancy and increased flexibility for circuit design, enhancing system reliability.

Maximum Seated Height: 0.8 mm

With a maximum seated height of 0.8mm, this IC is slim and compact, making it suitable for space-constrained applications.

Width (mm): 2.6 mm

The 2.6mm width of this IC allows for easy integration into compact electronic devices, optimizing PCB layout and overall system size.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

Designed as a power supply support circuit, this IC enhances system stability and efficiency in various power management applications.

Minimum Supply Voltage (Vsup): 2.6 V

The 2.6V minimum supply voltage ensures compatibility with low-power systems, extending the range of applications for this IC.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this IC withstands manufacturing processes, ensuring robust performance during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable soldering of the IC onto PCBs, ensuring strong mechanical bonds and electrical connections.

Length: 3.8 mm

The 3.8mm length of this IC contributes to its compact form factor, enabling space-saving design solutions in electronic systems.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades, this IC can operate reliably in harsh environments commonly found in industrial applications.

Maximum Supply Current (Isup): 0.006 mA

The low maximum supply current of 0.006mA results in minimal power consumption, making it an energy-efficient choice for power management.

Technology: CMOS

Utilizing CMOS technology, this IC offers low power consumption, high noise immunity, and versatile design options, ensuring efficient power management.

Terminal Form: NO LEAD

The no-lead terminal form reduces environmental impact and facilitates lead-free manufacturing processes, aligning with modern industry standards.

Terminal Pitch: 0.65 mm

The 0.65mm terminal pitch provides precise spacing for connections, allowing for accurate placement on PCBs and ensuring reliable electrical contact.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this IC can withstand standard humidity exposure during storage and assembly, ensuring long-term reliability.

Maximum Supply Voltage (Vsup): 4.3 V

The 4.3V maximum supply voltage accommodates a wide range of power sources, enhancing compatibility with diverse electronic systems.

Technical Specifications

Power Management ICs LC05111C25MTTTG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e6

Length:

3.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.16,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current (Isup):

.006 mA

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

2.6 V

Nominal Supply Voltage (Vsup):

3.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.6 mm

Trade Compliance

LC05111C25MTTTG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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