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LC05111C06MTTTG

Onsemi

LC05111C06MTTTG by Onsemi

LC05111C06MTTTG by Onsemi is a Power Management IC with a nominal voltage of 3.7V, suitable for industrial applications. It features a package style of Small Outline, Heat Sink/Slug, Very Thin Profile and has a max operating temperature of 85 °C. With surface mount capability and dual terminal position, it offers power supplies of 2/5V for various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 628 parts In-Stock

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Vyrian

USA . 375 parts In-Stock

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375

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Distributors (Availability)

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TANS Electronics

Latvia . 8,086 parts In-Stock

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8,086

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Problanco Electronics

Mexico . 6,062 parts In-Stock

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6,062

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SupplyDigital Components

Austria . 5,923 parts In-Stock

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5,923

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Kulean Microsystems

USA . 4,216 parts In-Stock

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4,216

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UHIMA Technologies

Türkiye . 876 parts In-Stock

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876

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Corohmni

South Africa . 343 parts In-Stock

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343

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Corphita

USA . 292 parts In-Stock

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Overview

Unlock the power of efficient energy management with the LC05111C06MTTTG by Onsemi. Crafted with precision and quality materials, this Power Management IC offers unparalleled performance and reliability. Ideal for a wide range of applications, this product ensures optimal power supplies with its innovative design and advanced technology. Experience seamless operation and enhanced functionality with the LC05111C06MTTTG, providing customers with unmatched value and benefits. Trust Onsemi to deliver top-notch solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight, cost-effective, and offers good resistance to heat and chemicals, making this product durable and reliable.

Surface Mount: YES

Surface mount design enables easy installation on circuit boards, saving space and providing a clean and professional look to the product.

Nominal Supply Voltage (Vsup): 3.7 V

Nominal supply voltage of 3.7 V ensures optimal performance and compatibility with various power sources without the risk of overloading the device.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C allows the product to withstand harsh environmental conditions and maintain stable performance under heat stress.

Technology: CMOS

CMOS technology ensures low power consumption, high speed, and reliable operation, making this product energy efficient and suitable for battery-powered devices.

Technical Specifications

Power Management ICs LC05111C06MTTTG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-N6

Length:

3.8 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.16,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.006 mA

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

2.6 V

Nominal Supply Voltage (Vsup):

3.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.6 mm

Trade Compliance

LC05111C06MTTTG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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