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LC05111C01MTTTG

Onsemi

LC05111C01MTTTG by Onsemi

LC05111C01MTTTG by Onsemi is a Power Management IC with 6 terminals, operating voltage of 2.6-4.3V, and temp range of -40 to 85 °C. It features CMOS technology, NO LEAD terminal form, and is suitable for industrial applications requiring power supply support circuits in compact spaces.

Median Price

$0.847

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,897 parts In-Stock

1+ parts

-

100+ parts

$0.847

1k+ parts

$0.703

10k+ parts

$0.627

2,897

-

$0.847

$0.703

$0.627

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,646 parts In-Stock

1+ parts

$0.659

100+ parts

-

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-

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-

1,646

$0.659

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-

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Vyrian

USA . 8,952 parts In-Stock

1+ parts

-

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8,952

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Distributors (Availability)

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Corphita

USA . 1,194 parts In-Stock

1+ parts

$0.625

100+ parts

-

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-

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1,194

$0.625

-

-

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Corohmni

South Africa . 321 parts In-Stock

1+ parts

$0.694

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-

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321

$0.694

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AZTECH Wire

Italy . 216 parts In-Stock

1+ parts

$16.140

100+ parts

-

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216

$16.140

-

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Advanced Electronics

New Zealand . 56 parts In-Stock

1+ parts

$29.456

100+ parts

$26.805

1k+ parts

$24.154

10k+ parts

-

56

$29.456

$26.805

$24.154

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Component Stockers USA

USA . 789 parts In-Stock

1+ parts

$99.990

100+ parts

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10k+ parts

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789

$99.990

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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SupplyDigital Components

Austria . 7,733 parts In-Stock

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7,733

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Problanco Electronics

Mexico . 4,140 parts In-Stock

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4,140

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Kulean Microsystems

USA . 2,309 parts In-Stock

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2,309

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TANS Electronics

Latvia . 1,191 parts In-Stock

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1,191

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UHIMA Technologies

Türkiye . 956 parts In-Stock

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956

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Microchip USA

USA . 175 parts In-Stock

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175

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Overview

Experience the superior quality and reliability of Onsemi with the LC05111C01MTTTG Power Management IC. This versatile component is perfect for a wide range of applications, offering unparalleled performance and efficiency. With Onsemi's reputation for excellence in manufacturing, you can trust that this product will deliver exceptional results every time. Upgrade your power management systems today and unlock a whole new level of functionality with the LC05111C01MTTTG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and reliable, making the product long-lasting.

Surface Mount: YES

Can be easily mounted on PCBs, saving space and making installation easier.

Nominal Supply Voltage (Vsup): 3.7 V

Stable supply voltage ensures consistent performance of the power management IC.

Minimum Operating Temperature: -40 °C

Can operate in very low temperatures, making it suitable for a wide range of environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Power Management ICs LC05111C01MTTTG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e6

Length:

3.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.16,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.006 mA

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

2.6 V

Nominal Supply Voltage (Vsup):

3.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.6 mm

Trade Compliance

LC05111C01MTTTG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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